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ON Semiconductor Announces Integrated Solutions for Industrial Motor Drives at APEC 2021

June 14, 2021

Rugged, transfer-molded modules simplify compact motor drive design

APEC 2021 – PHOENIX, Ariz. – June 14, 2021 – ON Semiconductor® (Nasdaq:ON), driving energy efficient innovations, announces new, integrated, converter-inverter-power factor correction (PFC) modules for use in industrial motor drives , servo drives and HVAC where they are used to drive motors for applications including fans and pumps.

The new NXH50M65L4C2SG and NXH50M65L4C2ESG are transfer−molded power integrated modules (TMPIM) based upon standard aluminum oxide (AI2O3) substrate and enhanced low thermal resistance substrate respectively. Ideally suited to rugged industrial applications with high output power, the modules contain a converter−inverter−PFC circuit consisting of single-phase converter with four 75 A, 1600 V rectifiers. The 3-phase inverter uses six 50 A, 600 V IGBTs with inverse diodes and the dual−channel interleaved PFC comprises two 75 A, 650 V PFC IGBTs with inverse diodes and two 50 A, 650 V PFC diodes. An NTC thermistor is embedded to allow for monitoring of device temperature during operation.

As the module is pre-assembled in an optimized layout and configuration, parasitic elements are very small when compared with discrete PCB-based designs, thereby allowing a wide PFC switching frequency range between 18 kHz and 65 kHz. The highly efficient NXH50M65L4C2SG and NXH50M65L4C2ESG are rated at 50 A permitting use in applications up to 8 kW, and are the latest devices in the ON Semiconductor TMPIM family. Other devices are available with current ratings of 20 A and 30 A.

The compact transfer-molded DIP-26 package measures just 73 mm x 47 mm x 8 mm – a 20 percent area savings over current solutions that enables higher levels of power density. The sealed and robust package includes an integrated heatsink (with 6 mm clearance to pins) and offers high levels of corrosion resistance.

A silicon carbide (SiC) option is also available for further increased switching frequency and efficiency.

The new NXH50M65L4C2SG and NXH50M65L4C2ESG work alongside the FAN9672 PFC controller and gate driver solutions including devices in the new NCD5700x family. The recently introduced NCD57252 dual channel isolated IGBT/MOSFET gate driver offers 5 kV of galvanic isolation and can be configured for dual low-side, dual high-side or half-bridge operation. The NCD57252 is housed in a small SOIC-16 wide body package and accepts logic level inputs (3.3 V, 5 V & 15 V). The high current device (source 4.0 A / sink 6.0 A at Miller plateau voltage) is suitable for high-speed operation as typical propagation delays are 60 ns.

Driving motors in the most efficient way is key to simplifying installation, lowering heat build-up, enhancing reliability as well as reducing system costs. The ON Semiconductor TM-PIM devices standardize the pinout with minimized parasitic to give designers a high performance ‘plug and play’ solution. Coupling the NXH50M65L4C2SG and NXH50M65L4C2ESG with FAN9672 and NCD57252 provides a rapid design path to a sophisticated and efficient motor control solutions.

During APEC 2021, ON Semiconductor will showcase SiC solutions for industrial applications. To register as a visitor to APEC 2021, please visit

Additional resources & documents:

Landing page: Industrial Drive Solutions

Video: Robust and Energy Efficient Industrial Drive Solutions

Blog: Robust and Energy Efficient Industrial Drive Solutions


About ON Semiconductor
ON Semiconductor (Nasdaq: ON) is driving energy efficient electronics innovations that help make the world greener, safer, inclusive and connected. The company has transformed into our customers’ supplier of choice for power, analog, sensor and connectivity solutions. Our superior products help engineers solve their most unique design challenges in automotive, industrial, cloud power, and Internet of Things (IoT) applications.

ON Semiconductor operates a responsive, reliable supply chain and quality programs, and robust ESG programs. Headquartered in Phoenix, Arizona, the company has a global network of manufacturing facilities, sales and marketing offices and engineering centers in its key markets.

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