Wi-Fi 8 prioritizes connection reliability over increasing headline speeds, aiming to make more effective use of the same tri-band (2.4GHz, 5GHz, 6GHz) spectrum. It also introduces enhancements for popular mesh networking (multiple access points), more reliable connections in congested airspace, improved power efficiency for IoT devices, and greater signal reach—all of which enhance the user experience.

We’ve created a TL;DR alternative of our white paper in a new infographic that simplifies and guides you through the technologies expected to power the next Wi-Fi standard.

MediaTek has authored a white paper outlining next-generation Wi-Fi 8. Key insights include:

• Multi-AP co-ordination
• Further optimizations to spectral efficiency
• Extended range
• Power efficiency improvements

However, Wi-Fi 8 prioritizes one aspect of wireless communication that has become increasingly critical: reliability.

Whereas 802.11be, which became commercialized as Wi-Fi 7, was termed “Extremely High Throughput”, 802.11bn, which is expected to be accepted as Wi-Fi 8, is focused on “Ultra High Reliability”.

This white paper discusses the new features in Wi-Fi 8, the parity of cellular and Wi-Fi connectivity, general market trends influencing the next-generation, and how MediaTek Filogic endeavors to continue its market-leadership in Wi-Fi, before committing to a technical evaluation of the new technologies.

RDK and MediaTek Unveil New Hardware Reference Platform for Wi-Fi 7 Broadband CPE

• New reference board to enable operators, CPE manufacturers, and app developers to easily and rapidly test and launch next-gen RDK-B routers, gateways, and applications   
• MediaTek collaborates with RDK to create new broadband reference board based on Banana Pi open-source hardware project 

PARIS, October 3, 2024 – In advance of the annual NetworkX conference, RDK Management and MediaTek unveiled a new RDK-B hardware reference platform designed to enable broadband operators, CPE manufacturers, and app developers to rapidly test and launch new Wi-Fi 7 RDK-B routers and gateways. By combining open-source hardware powered by MediaTek with RDK’s open-source software, companies now have an easy-to-use platform to accelerate their RDK-B development and deployment efforts.

RDK is an open-source software solution deployed on more than 100 million devices that standardizes core functions used in broadband and video devices. For broadband specifically, RDK-B provides core functionalities including device management, telemetry, Wi-Fi services, Ethernet access, IPv6 transitioning and more that work across all major network access technologies including DOCSIS, GPON, DSL, and Fixed Wireless Access (FWA). By packaging and open sourcing these functions in a single standard software stack, service providers can develop, deploy, and manage a consistent set of broadband services across SoCs and OEMs for use across their networks and geographic footprints.

“This new open reference hardware, powered by MediaTek, gives the RDK community a powerful new tool to innovate with next-gen broadband applications and services atop of RDK-B,” said Jason Briggs, President and General Manager of RDK. “By leveraging both open-source software and open-source hardware, companies can accelerate their RDK development and deployment initiatives in an easier and more frictionless way. MediaTek is recognized for delivering cost-effective and high-quality SoC solutions, and we’re very grateful for their efforts to bring this compelling new RDK-B reference board to the RDK community.”

“As a global leader in wireless connectivity, MediaTek’s collaboration with RDK Management underscores our commitment to driving Wi-Fi 7 technology to more markets like the open-source community,” said Alan Hsu, Corporate Vice President, Intelligent Connectivity Business Unit at MediaTek. “We strive to provide the fastest, most reliable and always-on Wi-Fi performance, which is ideal for the MediaTek Filogic 880 tri-band platform as the chosen solution on the Banana Pi-R4 Wi-Fi 7 router reference design. This will not only enable us to reach a broader developer base in the open-source community, but it will also allow easy access for operators, manufacturers and developers who seek to adopt open-source software with the latest connectivity features.”

Technical Specs

The new Banana Pi BPI-R4 router board gateway is powered by MediaTek Filogic 880 SoC. It provides a unique single-chip MLO (Multi-link operation) architecture that optimizes performance in Wi-Fi 7 networks designed to dramatically lower latency compared to alternatives. The BPI-RF router also includes:

• 4 GB DDR4 (Double Data Rate 4 Random Access Memory) RAM
• 8 GB eMMC (embedded MultiMediaCard)
• 128 MB SPI-NAND (Serial Peripheral Interface NAND) flash
• MicroSD card slot and 1x M.2 KEY-M (PCI-Express 3.0 x1) for NVMe SSDsn (Non-Volatile Memory Express Solid-State Drives)
• Network interfaces include 2x 10Gb SFP (Small Form-factor Pluggable); 4x GbE(Gigabit Ethernet); plus support for 4G/5G nano SIM cards with M.2 B-Key (USB 3.2) for a cellular adapter card and 26-pin GPIO (General-Purpose Input/Output) for expansion and customization opportunities
• iPA (Integrated Power Amplifier) Network Interface Card fits the 2x mini-PCI-E slots on the rear side of the board. It contains Filogic chips providing 2.4GHz (4T4R) 5GHz (4T4R) and 6GHz (4T5R), plus dedicated SM/DFS Spectrum Management/Dynamic Frequency Selection) antenna
• MediaTek’s unique 4T5R platform allows for improved Receive Diversity and supports MRC (Multiple Receive Combining) that boosts 6GHz band throughput and range

The Banana Pi reference board is available to purchase online at Amazon.com, and the newest RDK-B software code to flash onto the device will be available in Q4 2024.  More information about RDK is at www.rdkcental.com.

About RDK Management

RDK Management is an open-source consortium that manages RDK for the global community. RDK is an open-source software solution that standardizes core functions used in broadband, video, and IoT devices. Deployed on more than 100 million devices, RDK enables service providers to control their device diagnostics data, business models, and apps to improve the customer experience and drive business results. The RDK community is comprised of more than 600 companies including CPE manufacturers, SoC vendors, software developers, system integrators, and service providers. For more information on the tools, training, and events provided by RDK Management, please visit: www.rdkcentral.com.

New chipset combines a second-generation All Big Core design with industry-leading AI, compute, gaming, and photography capabilities

HSINCHU, Taiwan – Oct. 9, 2024 – MediaTek today launched the Dimensity 9400, the company’s new flagship smartphone chipset optimized for edge-AI applications, immersive gaming, incredible photography, and more. The Dimensity 9400, the fourth and latest in MediaTek’s flagship mobile SoC lineup, offers a massive boost in performance with its second-generation All Big Core design built on Arm’s v9.2 CPU architecture, combined with the most advanced GPU and NPU for extreme performance in a super power-efficient design.

The Dimensity 9400 adopts MediaTek’s second-gen All Big Core design, integrating one Arm Cortex-X925 core operating over 3.62GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This design offers 35% faster single-core performance and 28% faster multi-core performance compared to MediaTek’s previous generation flagship chipset, the Dimensity 9300. Built on TSMC’s second-generation 3nm process, the Dimensity 9400 is up to 40% more power-efficient than its predecessor, allowing users to enjoy longer battery life.

“The MediaTek Dimensity 9400 will continue furthering our mission to be the enablers of AI, supporting powerful applications that anticipate users’ needs and adapt to their preferences, while also fueling generative AI technology with on-device LoRA training and video generation,” said Joe Chen, President at MediaTek. “As the fourth-generation flagship chipset, the Dimensity 9400 continues to build on our momentum of steady growth in market share, and MediaTek’s legacy of delivering flagship performance in the most efficient design for the best user experiences.”

Packing MediaTek’s 8th Generation NPU, the Dimensity 940feature0 boasts a number of industry firsts for exceptional generative AI performance; it is the first mobile chipset to offer on-device LoRA training, high-quality on-device video generation, and developer support for Agentic AI. To allow users to take advantage of the latest agentic and generative AI applications, the Dimensity 9400 offers up to 80% faster large language model (LLM) prompt performance while also being up to 35% more power efficient than the Dimensity 9300.

The Dimensity 9400 also integrates MediaTek’s new Dimensity Agentic AI Engine (DAE), which is designed to turn traditional AI applications into sophisticated agentic AI applications. MediaTek is working with developers to offer a unified interface between AI agents, third-party APKs, and models that efficiently runs both edge AI and cloud services. This streamlined approach allows models to work with many different third-party APKs, which reduces development time and will help usher in a new ecosystem of agentic AI applications.

The 12-core Arm Immortalis-G925 delivers super immersive gaming experiences with up to 40% faster raytracing performance compared to the previous generation. The Dimensity 9400 also brings PC-level features to smartphones with opacity micromaps (OMM) support for realistic effects. The chipset’s powerful GPU also offers 41% peak performance boost with up to 44% power savings compared to the Dimensity 9300, allowing users to game for longer. Additionally, the Dimensity 9400 supports HyperEngine technology for super resolution and impressive picture quality, which is co-developed by MediaTek and Arm Accurate Super Resolution (Arm ASR).

With MediaTek Imagiq 1090, the Dimensity 9400 provides HDR video recording throughout the entire zoom range so users can snap the perfect moment from a distance; MediaTek’s Smooth Zoom technology also makes it easy to capture moving subjects. Additionally, it is designed to minimize power consumption while users are taking photos and videos, offering up to 14% lower power consumption in 4K60 video capture compared to the Dimensity 9300.

Additional features of the Dimensity 9400 include:

• A refreshed 3GPP Release-17 5G modem with 4CC-CA and up to 7Gbps sub-6GHz performance.
• New 4nm Wi-Fi/Bluetooth combo chip with 7.3Gbps data rates performance and up to 50% lower power consumption compared to the previous generation.
• Support for Wi-Fi 7 tri-band MLO.
• MediaTek Xtra Range^TM 3.0, which delivers up to 30m greater Wi-Fi coverage.
• 5G/4G Dual SIM Dual Active, Dual Data capabilities to give users more flexibility.
• Support for tri-fold smartphones giving smartphone makers the flexibility to design innovative new form factors.

The first smartphones powered by the MediaTek Dimensity 9400 will be available in the market starting in Q4 of 2024. To learn more about MediaTek’s Dimensity portfolio, please visit: https://www.mediatek.com/products/smartphones-2/mediatek-dimensity-9400.

VIA Technologies has launched its powerful new range of IoT platforms, the SOM-5000, VAB-5000, and ARTiGO A5000, designed for industrial, commercial, and consumer applications that require highly capable edge AI.

Product designers have the option of the VIA SOM-5000, an advanced system-on-module that mounts into a carrier board; the VAB-5000, a pico-ITX form factor with built-in flexible I/O, a 40-pin RPi compatible connector, and direct DC power; and the ARTiGO A5000, an ultra-compact full system. All three are fanless designs, offering exceptional power-efficiency and extensibility.

At their heart, the MediaTek Genio 700 provides a powerful octa-core CPU featuring two Arm Cortex-A78 processors, plus a highly capable Mali-G57 GPU, dual display support, and advanced AV1/H.265/H.264 video decoding. Its multi-core NPU accelerates edge AI applications, enabling immediate responsiveness with on-chip processing. The integrated ISP supports very high-resolution cameras via the dual MIPI CSI interface. Connectivity includes Gigabit Ethernet MAC, plus options for WiFi-6 and 5G wireless connectivity. Applications can be developed using popular Android, Yocto Linux, or Ubuntu OS, and benefit from MediaTek’s NeuroPilot SDK for accelerating AI integration.

Learn more about VIA Technologies’ new Genio 700 powered platforms >

Among the growing uses of AI, one potential application is industrial systems. AI extends the capabilities of machines to sense, learn, reason, and interact with humans in ways that are natural, intuitive, and complementary to the way we work. By pairing AI with IoT to create edge-AI, and connecting insights across production processes, manufacturers can achieve higher quality final products, while also increasing the safety, efficiency, and sustainability of industrial processes. In fact, a recent McKinsey survey found that AI has the potential to unlock approximately $1 trillion in value from the global industrial sector^.1

Several use cases have been identified outlining how industrial manufacturers can capture value from AI through technologies such as vision systems, speech-to-text, enhanced connectivity and smart power management:

1. Plant consumption and energy management
2. Quality sensing and detecting
3. Smart Conveyance
4. Factory asset intelligence – performance management
5. Digital product development – digital twin
6. Factory synchronization and dynamic scheduling
7. Augmented workforce efficiency
8. Additive manufacturing

Read on to learn how MediaTek Genio can bring effective edge-AI technologies into your industrial processes. >