TAIPEI, Taiwan – May 28, 2026 – MediaTek will showcase its next-generation edge-to-cloud technologies and solutions for the Agentic AI era at Computex 2026. Themed “AI Without Limits,” booth highlights include the award-winning Wi-Fi 8 product series; edge computing platforms empowering Agentic AI across tablets, automotive, and IoT; 6G and satellite communication technologies; and advanced data center solutions. This comprehensive lineup will demonstrate MediaTek’s robust R&D capabilities and limitless innovation in the age of AI.
“By delivering diverse platforms that provide extreme computing power to devices, advancing data center technologies, and driving seamless communication, we hold a distinct advantage in Agentic AI that spans from edge to cloud,” said Joe Chen, President of MediaTek. “At such an important inflection point for the industry, we remain committed to working closely with global partners, customers, the AI ecosystem, and the semiconductor supply chain to push forward the acceleration of ubiquitous AI and further expand investments in AI infrastructure.”
Empowering the Edge with Agentic AI
MediaTek and NVIDIA will showcase NVIDIA DGX Spark, an agentic AI powerhouse built on the NVIDIA GB10 Grace Blackwell Superchip. Its 1-PetaFLOP GPU and 20-core CPU share coherent unified LPDDR5x memory to deliver effortless on-device hosting of large AI models which empower autonomous, intelligent task orchestration that redefines desktop productivity. The showcase will also highlight one of the first gaming monitors powered by NVIDIA G-SYNC Pulsar scaler chip.
Additionally, MediaTek continues to innovate to make the future of automobiles more integrated with AI. The MediaTek Dimensity AX C-X1 flagship smart cockpit platform includes NVIDIA’s AI and gaming technologies, supporting the convergence of Agentic AI and perceptual computing, hybrid edge-cloud computing, and concurrent AI and HMI (Human-Machine Interface) operations. The world’s first automotive chipset to support AAA games, the C-X1 transforms the vehicle’s system from a passive tool into a proactive AI smart cockpit capable of truly understanding both the car and its passengers. Alongside it is the Dimensity AX MT2739, a flagship telematics platform and the world’s first automotive chipset supporting 3GPP R18 5G NR-NTN satellite video calls from anywhere on the planet. It features built-in MediaTek Modem AI (MMAI) technology, which successfully reduces stuttering by 30% in handover scenarios like driving into underground parking or tunnels during a conference call or navigation apps.
Advancing High-Performance Computing Across Edge Devices
MediaTek will also highlight multiple applications tailored for high-end computing. These include smartphone and tablet platforms supporting offline AI generation, the latest e-reader platform with meeting transcription capabilities, Chromebook platforms built for efficient support of AI productivity applications, and a scaler platform supporting 5K wide-screen AI super-resolution gaming monitors. The showcase will include IoT platforms running the OpenClaw model, commercial drone solutions, AMRs, and industrial and retail applications. In the smart home sector, the MediaTek Pentonic 800 is the world’s first AI TV SoC to support Dolby Vision 2. This enables TVs to unlock their full potential to deliver a more authentic and captivating picture with innovations like Dolby’s next-generation Image Engine, Content Intelligence, and Authentic Motion. Several TV models utilizing this chip will be available in market with Dolby Vision 2 later this year.
Data Center Technology Advancements for Cloud AI
Pushing beyond just a single component, MediaTek Data Center Solutions (DCS) delivers truly end-to-end AI data center platforms, ranging from custom ASIC designs and custom XPUs, advanced 2.5D/3.5D packaging, and state-of-the-art high-speed interconnect, to full rack-level integration. DCS weaves the fabric of AI scaling into a single unified system that enables customers to build data centers that achieve superior performance per TCO and performance per watt at scale.
Continuing its investment in next-gen technologies to address the industry’s demand for silicon photonics and higher bandwidth density, MediaTek is showcasing two key advancements at Computex 2026. The first is a Co-Packaged Optics (CPO) technology reaching bandwidth speeds of up to 400Gbps per fiber. The second is the integration of MicroLED-based technology for data center interconnect. Currently applied to Active Optical Cables (AOCs) at the show, this technology features monolithic integration into CMOS transceivers, matching copper wire reliability and lowering power consumption by 50% while remaining fully compatible with existing equipment. This MicroLED-based technology is also applicable to both CPO and Near-Packaged Optics (NPO).
The Highway of the AI Era: 6G and Wi-Fi 8 Connectivity
Featuring an advanced iteration of Dynamic Sub-Channel Operation (DSO) technology, the MediaTek Filogic 8800 is the world’s first cross-generation-interoperable Wi-Fi 8 chipset. This solution directly improves the connection stability of existing Wi-Fi devices, increases system throughput by 200%, and reduces file download times by up to 50%. By maximizing real-world spectrum efficiency, it accelerates the global transition to a premium Wi-Fi era. Accompanying this is MediaTek Filogic AI, the world’s first AI-empowered smart Wi-Fi experience. Its core features include AI Network Doctor, AI Power Saving, Performance Optimization, and Smart Traffic Scheduling. AI Network Doctor slashes average repair times from 2-4 hours to under 1 minute and reduces field maintenance dispatches by 20%, potentially saving major operators hundreds of millions of dollars annually. Meanwhile, the AI Power Saving mode adapts precisely to daily usage behaviors, ensuring 24/7 high performance while cutting power consumption by 50%.
The T930 5G FWA platform is the world’s first to boast both 3GPP Release 18 and Wi-Fi 8 capabilities. Combined with AI Network Engine technology, it delivers a noticeably upgraded internet experience. In recent years, MediaTek has partnered with global network and FWA ecosystem partners, including Askey, Compal, FII, NEC Platforms, Pegatron, Sercomm, WNC, and Zyxel, to continuously expand deployments and develop competitive product portfolios, striving to become a key partner for top-tier global telecom operators.
Finally, MediaTek will showcase two leading-edge 6G technology concepts. As an active driver of 6G standards, MediaTek is presenting the world’s first demonstration of 6G radio interoperability. This technology balances high-speed transmission with exceptional scheduling flexibility for low latency and low power consumption. It is poised to support future hybrid edge-cloud Agentic AI collaboration models, making it ideal for massive Agentic AI applications such as robot AI-to-AI, human-to-AI, and service-to-AI interactions. The second concept is 6G device collaborative MIMO (Co-MIMO) technology, which allows smartphones or wearables to aggregate signals from other indoor 6G devices. This effectively boosts downlink throughput by over 60%, heavily empowering ultra-low latency applications.
For more information regarding MediaTek at Computex 2026, please visit Booth L0818 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1) or go to: https://www.mediatek.com/computex2026
About MediaTek Inc.
MediaTek (TWSE: 2454) is a global leader in fabless semiconductor design, providing solutions from the edge to the cloud. Powering over 2 billion connected devices every year, MediaTek’s leading-edge technology keeps the world connected and enhances everyday life. At the forefront of innovation, MediaTek drives advancements in transformative technologies such as AI, 5G/6G, and Wi-Fi 7/Wi-Fi 8. Our high-performance, power-efficient products form the foundation for a smarter, more connected world, enabling devices from smartphones, smart homes and AI PCs to high-performance computing, automotive, and AI data centers. As a trusted partner to the world’s leading brands, MediaTek leads the industry in creating solutions that meet the evolving needs of the global community, ensuring access to world-class technology for everyone. Our commitment to accelerating AI underscores our dedication to enriching the future of humanity. Visit http://www.mediatek.com for more information.
AI is rapidly moving into the physical world, giving rise to physical AI. This shift enables systems to perceive, decide, and act in real time, interacting directly with dynamic, unpredictable environments. Robotics and commercial drones are at the forefront of this evolution, driving new levels of automation and efficiency across healthcare, retail, transportation, and manufacturing.
In high-risk environments such as agriculture, warehouses, and industrial plants, robots and drones reduce human exposure to hazardous conditions. Ground-based robots handle repetitive or physically demanding tasks, while drones provide visibility across large or hard-to-reach areas, enabling real-time monitoring, inspection, and data collection.
In commercial settings, robots are reshaping the customer experience. For example, in retail stores, robots can answer questions, fetch products, and provide information. Drones extend these capabilities beyond the store, supporting inventory tracking, last-mile delivery, and site-to-site logistics with speed and efficiency. Together, these systems create a more responsive, intelligent operating environment, where physical tasks and real-time insights work in sync.
Bringing these intelligent, autonomous systems to life requires advanced hardware, a rich software ecosystem, and state-of-the-art AI models.
Hardware: Enabling real-time intelligence and durability
At the hardware level, robotics and drones demand powerful, efficient compute capable of handling real-time perception, decision-making, and multimodal processing. While many deployments will leverage a hybrid approach that combines edge and cloud, processing at the edge remains critical for delivering the speed, responsiveness, and low latency these systems require.
MediaTek’s Genio Pro 5100 is designed to meet these demands for physical AI applications. Based on TSMC’s 3nm process and featuring our 8th generation NPU, it delivers over 50 TOPS of system-level generative AI acceleration. This enables unrivaled acceleration for traditional AI tasks such as machine vision and object classification.
For generative AI applications, Genio Pro 5100 supports token generation rates of up to 23 tokens per second for large language models (LLMs) with up to 7B parameters. Genio Pro 5100 enables advanced camera sensor fusion for vision-based applications, supporting up to 16 cameras. It also delivers rich user interfaces, supporting up to three 4K displays.
Deploying physical AI in robotics and drones requires systems that can operate reliably under a variety of real-world conditions, from extreme temperatures to demanding industrial settings. Genio Pro 5100 is engineered to meet these requirements, with an industrial operating temperature range of -40°C to +105°C.
For improved manufacturability and system reliability, Genio Pro 5100 supports side-by-side LPDDR5x. Additionally, the platform offers flexible system expansion through PCIe Gen 4, USB, dual 2.5GbE, and a wide range of standard interfaces. Backed by a guaranteed 10-year supply commitment, the platform safeguards long-term product roadmaps and reduces supply chain risk for industrial and robotics deployments.
Software: Unlocking developer flexibility
Software is what enables developers to translate AI models into real-world, deployable physical AI applications. Genio Pro 5100 supports multiple Linux operating systems, including Yocto, Debian, and Ubuntu distributions. It also supports industry-standard AI frameworks, including PyTorch, ONNX Runtime, and TensorFlow Lite, enabling seamless model development and deployment across a wide range of use cases.
For robotics applications, support for the open-source ROS 2 (Robot Operating System) framework helps streamline development, integration, and system orchestration. MediaTek’s robust developer resources further accelerate time-to-market, enabling developers to build, customize, and scale physical AI applications more efficiently.
AI models: From perception to action
Advances in AI models are expanding what robotics and drones can do in different environments. While large language models (LLMs) enable natural interaction, newer approaches such as video-language models (VLMs) and vision-language-action models (VLAs) make it possible for robotics and drone applications to go beyond observing and interpreting their environments to acting on those observations in real time.
These capabilities are enabling more autonomous systems, where robotics and drones can interpret their environments and respond intelligently and safely. Genio Pro 5100 is designed to support these emerging model architectures, providing the performance needed to run them efficiently.
Advancing physical AI
As physical AI moves from concept to deployment, Genio Pro 5100 provides the high-performance silicon, software flexibility, and AI model support needed for robotics and drones to operate intelligently. From edge inference and multimodal perception to autonomous decision-making, Genio Pro 5100 is powering the next wave of physical AI innovation.
IoT is now powering intelligent, autonomous systems, so developers need platforms that can handle real-time AI at the edge without sacrificing efficiency or scalability. That is exactly where the MediaTek Genio Pro comes in.
The MediaTek Genio Pro is a flagship platform designed for extremely high-performance, AI-driven embedded systems. Built on a cutting-edge 3nm process and equipped with an advanced AI processing unit capable of delivering over 50 TOPS of compute, it enables everything from real-time vision systems to on-device generative AI. With support for large language models, multi-camera inputs of up to 16, and rich multimedia capabilities such as 8K video, it is ready to support even the most demanding and varied applications.
Different industries will find unique value propositions in the MediaTek Genio Pro:
Robotics and Autonomous Systems Developers
Autonomous mobile robots or drones will benefit from Genio Pro’s sensor fusion, ROS2 support, and real-time AI inference, which allow them to sense, see, and make decisions instantly. It can process data from multiple cameras while running AI models locally, which is critical for navigation and decision making without cloud latency.
Industrial IoT Engineers
For factory automation, predictive maintenance, or machine vision, the platform’s certification for industrial temperatures ensures it fits demanding environments. High compute density combined with exceptional power efficiency lowers total cost of ownership by reducing lifetime power consumption, minimizing reliance on communication infrastructure, and lowering cloud server costs. Combined with Linux support including Yocto, Ubuntu, and Debian, it integrates smoothly into existing industrial stacks.
Smart Retail and Commercial IoT Builders
Developers working on smart kiosks, digital signage, or customer analytics systems can leverage multi-display support and edge AI to deliver personalized, real-time experiences throughout the store, all from a single device.
Edge AI and Generative AI Innovators
With on-device LLM capabilities that handle models up to 7B parameters, Genio Pro opens the door to private, low-latency generative AI applications, from intelligent or agentic assistants to advanced analytics at the edge.
At Embedded World, MediaTek demonstrated how we’re bringing a new level of edge AI capabilities to a wide range of IoT devices and applications, from robots and drones to smart homes and vehicles. We’re proving that edge AI isn’t limited to small, power-constrained devices anymore. Our Genio platform pairs extreme computing power and exceptional efficiency to enable impressive on-device generative AI and real-time multimodal processing at the edge in advanced IoT applications.
MediaTek’s brand new Genio Pro platform was a standout at the show and earned an Embedded World Best in Show Award from Embedded Computing Design. With 50+ TOPS of AI acceleration, plus support for up to 16 camera inputs and three 4K displays, Genio Pro is ideal for autonomous mobile robotics, industrial robotics, commercial drones, transportation and logistics platforms, and other advanced IoT devices.
We showcased MediaTek’s technology in action, with more than 15 demos at our booth and 20 MediaTek partners demonstrating our technology across the show floor. Below are some highlights:
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MediaTek’s partners made several announcements at Embedded World, reflecting the breadth of the MediaTek IoT ecosystem.
SECO introduced its SOM-Trizeps-X-Genio360/360P platform for cost-sensitive embedded applications. Powered by Genio 360 and Genio 360P, this platform delivers robust on-device generative AI processing for advanced HMIs, mobile and handheld devices, smart appliances, and AI-enabled edge systems. SECO also demonstrated its Modular Vision solution powered by Genio 700, showing how medical automation use cases including face recognition, voice command processing, and sample inspection can run entirely at the edge with ultra-low latency.
MiTwell, MediaTek and RGo Robotics, announced a next-generation visual real-time localization solution (RTLS) to accelerate the adoption of Physical AI across warehouses, logistics operations, and industrial environments. The solution enables machines such as forklifts, mobile robots, and drones to become visible, traceable, and context-aware in real time without complex infrastructure.
Lantronix expanded its embedded compute platform with new SOM solutions based on MediaTek’s Genio SoCs, targeting industrial and commercial edge AI deployments. Lantronix also demonstrated a MediaTek-powered drone solution developed with Teledyne FLIR OEM, highlighting real-time edge intelligence for vision-based workloads.
Grinn introduced the GenioSOM-360, which brings high-performance edge AI to space-constrained applications. The module, powered by Genio 360P, delivers advanced processing and AI capabilities for industrial automation, healthcare devices, and smart city deployments. Grinn also shared that the company plans to bring Genio Pro products to market.
Plus, Beckhoff demonstrated the company’s Genio 700 module, which will hit the market later this year.
Together, these demonstrations highlight how MediaTek and its partners are accelerating the next wave of intelligent, edge AI devices across industries.
The MediaTek Genio Pro 5100 brings flagship-class AI and computing performance to highly demanding industrial IoT applications such as robotics, commercial drones, machine vision systems, transportation, edge AI systems , and other advanced use cases.The Genio Pro 5100 supports powerful on-device generative AI, achieving token generation rates of up to 23 tokens per second for models with up to 7 billion parameters. The platform is designed to handle demanding real-time workloads where responsiveness, reliability, security, and data privacy at the edge are essential.
Built on an advanced 3nm process, the Genio Pro 5100 integrates an all-big-core octa-core CPU based on the latest Arm v9.2 architecture, delivering up to 260K DMIPS. It also features an Arm Immortalis-G925 GPU that provides up to 3.1 TFLOPS of compute performance, along with an 8th-generation MediaTek NPU offering more than 50 TOPS of system-level AI acceleration.
The platform supports up to 16 camera streams, up to three 4K displays, and 8K video encoding and decoding, making it well suited for sensor-rich and multimedia-intensive systems. With LPDDR5x memory support, extensive high-speed I/O, and an industrial temperature range of -40°C to +105°C, the Genio Pro 5100 is ready for robust commercial and industrial deployments.
MediaTek has partnered with ADLINK to create the MXA-312M, powered by the MediaTek Genio 520/720, that’s designed to deliver high-performance visuals in space-constrained environments.
MXA-312M Key Features:
Both the MediaTek Genio 520 and Genio 720 offer fast, highly capable edge AI computing, yet without sacrificing essential power efficiency so it can use a fanless enclosure. The device offers an exceptional balance power consumption and robust capabilities, making it the perfect engine for retail and industrial applications such as digital signage, smart retail kiosks, and industrial-grade displays.
To meet growing demand for faster, more reliable home connectivity, Deutsche Telekom partnered with MediaTek to develop the Speedport 7, a class-leading broadband gateway designed for nationwide deployment. The device marked Deutsche Telekom’s first Wi-Fi 7 program and required support for fiber, DSL, Ethernet, and cellular backup, along with seamless connectivity across an increasingly complex home network environment. It also represented the company’s most advanced in-house software integration to date.
MediaTek worked closely with Deutsche Telekom throughout the project, providing end-to-end support from design to deployment. This collaboration enabled key technologies such as Wi-Fi 7 Multi-Link Operation and EasyMesh, while ensuring compatibility with third-party applications and meeting strict requirements for quality, reliability, and security.
The result was the successful launch of Speedport 7 in October 2025. The device delivers Wi-Fi 7 BE7200 performance, dual-band operation, and broadband speeds of up to 2 Gbps, along with intuitive app-based management and robust security features.
Now widely deployed across Germany, Speedport 7 has received strong customer approval and industry recognition for its performance and reliability, demonstrating how close collaboration and advanced platform design can enable next-generation broadband experiences.
NEW YORK – Jan. 11, 2026 – At NRF 2026, MediaTek is showcasing a broad portfolio of connected solutions for the next generation of smart retail experiences. To usher in this new era of retail, MediaTek unveiled a high-performance, efficient IoT platform that combines 5G and Wi-Fi 7 support with powerful edge AI and multimedia capabilities. This platform, which leverages an octa-core ARMv9 CPU and embedded NPU to support generative AI, will help shape an array of retail IoT products, including automatic identification and data capture (AIDC) applications, table-service kiosks, point-of-sale systems, and digital signage solutions.
“NRF 2026 represents a prime opportunity to highlight the future of smart retail applications where connectivity and intelligence are boosting productivity and elevating consumer experiences,” said CK Wang, General Manager of the IoT Business Unit at MediaTek. “Our advanced computing, connectivity, edge AI, and multimedia capabilities are helping to equip retailers with the solutions they need to stay competitive as the retail landscape continues to evolve.”
Addressing consumer and market demands across retail with speed and power
The retail industry is progressing rapidly, driving a need for more advanced solutions that elevate both the customer journey and vendor experience. MediaTek’s IoT portfolio, on display at NRF alongside its collaborative partners, is transforming the capabilities of modern PDAs, retail-centric PCs and tablets, desktop and payment POS devices, and commercial displays.
At the show, MediaTek plans to highlight that the Genio platform of products is the best fit for edge AI applications in Smart Retail and Hospitality. This includes support for Vision AI and on-device Generative AI; dual-display support and remote management for desktop POS; 4K resolution; and a smart kiosk with self-checkout capabilities.
MediaTek has over 35 technical demonstrations on display that illustrate how retailers can deliver a true store-of-the-future experience. These demos highlight innovative use cases, including shelf organization, real-time inventory tracking, frictionless payments, and AI applications that improve operations and enhance customer interactions.
What’s ahead for the smart retail ecosystem, and the technologies driving change
On Monday, Jan. 12 at 10:30 a.m. ET, Sameer Sharma will take the Snowflake Stage at NRF to moderate a panel exploring the progress, pitfalls, and potential of AI in retail. The session will explore the new levels of personalization possible in applications such as interactive kiosks and the role that solutions like sensors, computer vision, and edge computing play in driving new vendor and customer experiences.
Shortly after his session, Sameer is joining an industry roundtable on Jan. 12 at 11:20 a.m. ET to examine the pulse of retail and look ahead to the technology, trends, and products driving the next wave of innovation.
To learn more about MediaTek at NRF 2026, please stop by our booth #6445 or visit: https://www.mediatek.com.
In a recent All About Circuits webinar, Sameer Sharma, AVP for IoT at MediaTek, spoke about how edge AI (on-device) is reshaping the Internet of Things, and why the MediaTek Genio platform is uniquely positioned to deliver that future. For OEMs and developers, it’s now time to embrace AI’s clear advantages and build devices that are powerful, efficient, and scalable. That’s exactly what MediaTek Genio was designed to do.
IoT Processors Built for Scale
IoT devices span everything from smart appliances to industrial systems, but they share a common need: a consistent, scalable foundation. The MediaTek Genio family delivers exactly that. The Genio 520 and Genio 720 platforms in particular are inter-compatible, giving OEMs flexibility so a simple chip swap allows a single hardware design to scale across different performance tiers. Similarly, the Genio 510 and 700 share the same design compatibility. This allows customers to accelerate development, reduce costs, and efficiently build “good / better / best” product lines to appeal to broad markets.
Scalability extends beyond performance. MediaTek Genio platforms include powerful NPUs in the chip, enabling on-device AI. They also support for advanced multimedia features and offer flexible connectivity options including Wi-Fi, Bluetooth, and cellular modem add-ons to fit diverse IoT applications, like mobile point-of-sale devices, to new markets like EV charging stations. Our unique expertise in multimedia, built on years of leadership in smartphones, smart homes, and smart TVs, brings these advanced capabilities into IoT from human machine interfaces (HMI), smart retail, to enterprise use, benefitting from multiple high-resolution displays, 4K video processing and rich audio capabilities for information and advertising – all from a single, highly power-efficient chip. And because IoT deployments demand long-term reliability, MediaTek Genio platforms are built with 10+ years of product longevity, multi-OS flexibility (Android, Linux, Ubuntu), and long-term OS and security support. Together, these features give product designers (OEMs) the confidence to scale solutions across markets and sustain them for the long term.
Optimized for Generative AI
Unlike platforms that have added AI on top an extra, MediaTek Genio was architected with AI at its core. The latest SoCs feature MediaTek’s 8th-generation NPUs, capable of up to 10 TOPS and optimized for both vision workloads, and emerging generative AI applications.
Customers increasingly want to run small language models for natural language interaction, personalization, and contextual decision-making all on-device, avoiding the cost and dependance on cloud services. MediaTek Genio enables this with:
This makes MediaTek Genio one of the first IoT platforms carefully optimized for GenAI at the edge, giving OEMs the ability to deliver next-generation AI experiences locally without depending on the cloud.
A Developer Ecosystem That Accelerates Time-to-Market
MediaTek understands that software is just as important as silicon. The MediaTek Genio Developer Portal provides SDKs, documentation, evaluation kits, and community resources to support developers at every stage.
Our partnership with NVIDIA adds even greater value; using the NVIDIA TAO Toolkit, developers can fine-tune pre-trained models on NVIDIA GPUs and seamlessly deploy them on MediaTek Genio NPUs. This integration bridges the training power of NVIDIA with the efficiency of MediaTek at the edge, giving developers a faster, more efficient path from prototype to deployment.
Edge AI is redefining IoT, and generative AI is accelerating that shift. To take advantage, OEMs need platforms that combine scalable design, AI performance, robust connectivity, and long lifecycle support.
Looking ahead, IoT adoption will be driven by AI-powered personalization, deeper integration of next-generation connectivity, and a growing focus on sustainability. MediaTek Genio is the platform built to deliver on these priorities, helping OEMs create devices that last longer, perform smarter, and reduce reliance on the cloud.
With MediaTek Genio, the edge is no longer an option, it’s a requirement. And it’s where the future of IoT is already being built. Learn more about MediaTek’s Genio Platforms.
