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Leadership appointments to take effect upon completion of previously announced transaction

IRVINE, Calif. and GREENSBORO, N.C., JULY 28, 2026 — Skyworks Solutions, Inc. (Nasdaq: SWKS) and Qorvo, Inc. (Nasdaq: QRVO) today announced the expected executive leadership team for the combined company, effective upon the successful completion of the pending transaction.

“Our expected leadership team unites deep industry expertise, proven operating experience and a shared commitment to helping customers solve their most complex challenges,” said Phil Brace, president and chief executive officer of Skyworks, who will serve as chief executive officer of the combined company. “Identifying this team is an important step in preparing us to move with clarity and conviction after close. This group will play a critical role in bringing together the strengths of both organizations, supporting a smooth transition and positioning our combined company to realize the tremendous opportunities ahead.”

The following executives are expected to report to Mr. Brace as of the closing:

  • Philip Carter – Chief Financial Officer and Senior Vice President
  • Philip Chesley – Senior Vice President and President of High Performance Analog
  • Kari Durham – Senior Vice President, Human Resources
  • J.K. Givens – Senior Vice President and General Counsel, Secretary
  • Yusuf Jamal – Senior Vice President and General Manager of RF and Mixed-Signal Intelligence Solutions
  • Reza Kasnavi – Executive Vice President, Chief Operations and Technology Officer
  • Joel King – Senior Vice President and General Manager of Mobile Solutions Business
  • Todd Lepinski – Senior Vice President, Sales and Marketing
  • Frank Stewart – Senior Vice President and President of Advanced Cellular

Bob Bruggeworth, president and chief executive officer of Qorvo, who is expected to join the board of directors of the combined company post-close, added, “Today’s announcement reflects the strong partnership that has shaped our integration planning efforts from the very beginning. I am confident these leaders will help foster collaboration across our teams as we build on the engineering excellence, innovation, and customer focus that have long distinguished both organizations.”

About Skyworks
Skyworks Solutions, Inc. is empowering the wireless networking revolution. We are a leading developer, manufacturer and provider of analog and mixed-signal semiconductors and solutions for numerous applications, including aerospace, automotive, broadband, cellular infrastructure, connected home, defense, entertainment and gaming, industrial, medical, smartphone, tablet and wearables.
Skyworks is a global company with engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America and is a member of the S&P 500® market index (Nasdaq: SWKS). For more information, please visit Skyworks’ website at: www.skyworksinc.com.

About Qorvo
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including automotive, consumer, defense & aerospace, industrial & enterprise, infrastructure and mobile. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.

Qorvo is a registered trademark of Qorvo, Inc. in the U.S. and in other countries. All other trademarks are the property of their respective owners.

Important Information About the Proposed Transaction and Where to Find It

In connection with the mergers, Skyworks has filed with the SEC a registration statement on Form S-4 (File No. 333-291947) (the “Registration Statement”), which includes a prospectus with respect to the shares of Skyworks’ common stock to be issued in the mergers and a joint proxy statement for Skyworks’ and Qorvo’s respective stockholders (the “Joint Proxy Statement/Prospectus”). The Registration Statement was declared effective on December 23, 2025, and Skyworks filed a final prospectus on December 23, 2025, and Qorvo filed a definitive proxy statement on December 23, 2025. The Joint Proxy Statement/Prospectus was mailed to stockholders of Skyworks and Qorvo on or about December 23, 2025. Each of Skyworks and Qorvo may also file with or furnish to the SEC other relevant documents regarding the mergers. This communication is not a substitute for the Registration Statement, the Joint Proxy Statement/Prospectus or any other document that Skyworks or Qorvo may mail to their respective stockholders in connection with the mergers.

INVESTORS AND SECURITY HOLDERS OF SKYWORKS AND QORVO ARE URGED TO READ THE REGISTRATION STATEMENT AND THE JOINT PROXY STATEMENT/PROSPECTUS INCLUDED WITHIN THE REGISTRATION STATEMENT, AS WELL AS ANY OTHER RELEVANT DOCUMENTS FILED WITH THE SEC IN CONNECTION WITH THE MERGERS OR INCORPORATED BY REFERENCE INTO THE REGISTRATION STATEMENT AND THE JOINT PROXY STATEMENT/PROSPECTUS (INCLUDING ANY AMENDMENTS OR SUPPLEMENTS THERETO), BECAUSE THEY WILL CONTAIN IMPORTANT INFORMATION REGARDING SKYWORKS, QORVO, THE MERGERS AND RELATED MATTERS.

The documents filed by Skyworks with the SEC also may be obtained free of charge at Skyworks’ website at https://www.skyworksinc.com/investors or upon written request to Skyworks at investor.relations@skyworksinc.com. The documents filed by Qorvo with the SEC also may be obtained free of charge at Qorvo’s website at https://ir.qorvo.com/ or upon written request to Qorvo at investor-relations@qorvo.com. These documents filed with the SEC are also available for free to the public at the website maintained by the SEC at www.sec.gov.

No Offer or Solicitation

This communication is for informational purposes only and does not constitute, or form a part of, an offer to sell or the solicitation of an offer to buy any securities or a solicitation of any vote or approval, nor shall there be any sale of securities in any jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such jurisdiction. No offer of securities shall be made except by means of a prospectus meeting the requirements of Section 10 of the Securities Act of 1933, as amended, and otherwise in accordance with applicable law.

GREENSBORO, NC – July 13, 2026 – Qorvo® (Nasdaq:QRVO), a leading global provider of connectivity and power solutions, today announced it has been recognized by Northrop Grumman Corporation with a 2026 Supplier Excellence Award for Strategic Excellence.

Northrop Grumman acknowledged Qorvo for Strategic Excellence, underscoring the vital role suppliers play in delivering next-generation capabilities across defense systems, including aircraft, missile defense and space platforms.

“Northrop Grumman has a legacy of fostering strong partnerships, a network of hardworking innovators and collaborators striving toward a mutual goal of protecting the United States and its allies,” said Ken Brown, vice president and chief supply chain officer, Northrop Grumman. “From putting the first humans on the moon to introducing stealth technology that revolutionized defense, Northrop Grumman and our partners have continually pushed the boundaries of what is possible.”

“This recognition reflects the strength of our strategic partnership with Northrop Grumman and our shared commitment to advancing next-generation defense technologies,” said Philip Chesley, president of Qorvo’s High Performance Analog business. “We are proud to support mission-critical applications with high-performance RF solutions that help enable global security.”

Qorvo’s contributions include delivering high-performance RF solutions and services supporting mission-critical applications across radar, communications and electronic warfare systems, helping enable advanced capabilities that strengthen the defense industrial base.

Northrop Grumman’s Supplier Excellence Awards highlight the critical role suppliers play in supporting more than 100,000 jobs and generating significant economic impact across the United States.

About Qorvo
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including automotive, consumer, defense & aerospace, industrial & enterprise, infrastructure and mobile. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.

GREENSBORO, NC – June 16, 2026 – QorvoÂŽ (Nasdaq:QRVO), a leading global provider of connectivity and power solutions, today announced it has received the Diamond Award from Chervon Group at Chervon’s 2026 Global Supplier Day. The Diamond Award is Chervon’s highest level of supplier recognition, reserved for partners who demonstrate sustained excellence in quality, innovation, delivery and strategic collaboration. The award recognizes Qorvo’s multi-year performance from 2023 through 2026.

Charles Wong, Qorvo vice president of APAC Sales, accepted the award on behalf of Qorvo at the Supplier Day ceremony.

“It was a tremendous honor to accept the Diamond Award on behalf of our team,” said Charles Wong. “This recognition is a credit to our sales, applications and operations teams who work alongside Chervon every day.”

Chervon is a leading global designer and manufacturer of handheld power tools, bench tools and outdoor power equipment, with a portfolio of brands that includes EGOÂŽ, FLEXÂŽ, DEVONÂŽ and SKILÂŽ. The company’s Supplier Day brings together its top global partners to recognize outstanding contributions in support of Chervon’s mission: “Better Tools. Better World.”

Qorvo’s Power Application Controller (PAC™) motor control and battery management solutions (BMS) power Chervon’s industry-leading portfolio.  Qorvo power solutions support the platforms which have made Chervon a global leader in cordless power tools and outdoor power equipment.

“We are honored to earn Chervon’s Diamond Award,” said Jeff Strang, general manager of Qorvo Power Management. “This recognition reflects the deep collaboration between our engineering teams, and our shared commitment to delivering best-in-class motor control, BMS and power solutions. We look forward to continuing to support Chervon as they bring next-generation cordless tools and outdoor power equipment to customers around the world.”

“Qorvo has been a trusted technology partner to Chervon, and their continued investment in motor control, BMS and advanced power solutions have been instrumental to our success” said Jianjun Run, GM Chervon Group. “The Diamond Award reflects Qorvo’s outstanding performance across quality, innovation and partnership, and we look forward to continuing to build the next generation of better tools together.”

Qorvo and Chervon have teamed for nearly a decade on motor control and battery management solutions across Chervon’s portfolio. The Diamond Award underscores this long-standing strategic partnership.

About Qorvo
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including automotive, consumer, defense & aerospace, industrial & enterprise, infrastructure and mobile. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.

GREENSBORO, N.C., May 18, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a major step forward in making Ultra-Wideband (UWB) real-time location systems (RTLS) deployable at enterprise scale. By combining industry standards including FiRa and Omlox with integration into Wi-Fi enterprise access points (EAPs), Qorvo enables precise, real-time location services without the need for dedicated RTLS infrastructure.

Qorvo addresses key barriers to RTLS adoption, including fragmented systems and the cost and complexity of dedicated anchor networks. By embedding UWB into enterprise Wi-Fi infrastructure, Qorvo enables location services to scale using existing access points and workflows. With over a decade of UWB innovation, the company provides a proven RTLS foundation deployed across healthcare, mining, logistics and automotive manufacturing environments.

“Real-time location has long been limited by infrastructure cost and lack of interoperability,” said Alexis Bizalion, Director of Product Marketing & Enablement at Qorvo. “By bringing standards-based UWB into enterprise Wi-Fi access points, we’re making real-time location a native capability of the network. We’re excited to enable OEMs, system integrators and solution providers to build and deploy RTLS solutions with greater flexibility, lower cost and reduced integration risk.”

A key differentiator is Qorvo’s collaboration with leading enterprise Wi-Fi providers to integrate UWB into access points, transforming Wi-Fi infrastructure into a dual-purpose platform for both connectivity and location services while reducing deployment cost and time to market. The company has achieved multiple industry-first UWB milestones, including:

  • FiRa-compliant RTLS deployments on EAPs in healthcare and logistics
  • Omlox-compliant RTLS deployments on EAPs in automotive manufacturing
  • Combined support of FiRa and Omlox standards within enterprise Wi-Fi infrastructure for interoperable RTLS deployments

At the core of this ecosystem is Qorvo’s new QPK3000 module, designed for tags and end devices. It enables interoperable UWB functionality across EAPs, dedicated anchors and other UWB-enabled infrastructure, simplifying development while ensuring compatibility across FiRa- and Omlox-based systems.

Qorvo recently showcased the QPK3000 and its RTLS ecosystem approach at the Wi-Fi NOW UWB Global Summit in Mountain View, CA, highlighting how standards-based UWB is enabling scalable, interoperable RTLS deployments. For more information on UWB RTLS, visit Qorvo’s Real-Time Location Systems (RTLS) page.

About Qorvo
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including automotive, consumer, defense & aerospace, industrial & enterprise, infrastructure and mobile. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.

The core mission of electronic warfare (EW) hasn’t changed: control the all communications so your forces can operate, and your adversary cannot. What has changed is everything around it. Today’s EW systems operate across airborne, naval and ground platforms that are increasingly built around multifunction RF architectures, where radar, sensing and electronic support capabilities are integrated into a single system.

In addition, performance expectations continue to rise. As threats appear without warning and signals shift instantly, response time is no longer measured in seconds, but in microseconds. Systems must continuously sense, interpret and respond across the entire RF spectrum.

EW environments now require wide instantaneous bandwidth, high output power and stable operation under extreme conditions. Publicly acknowledged frequency ranges such as 6–18 GHz and 32–38 GHz highlight the breadth of spectrum these systems must cover, often extending even further in practice.

Wideband RF Design Challenges in EW Systems

Wideband EW design comes with distinct design challenges because of the need to make one RF chain behave well everywhere, all at once, across frequency, power levels and operating conditions.

EW receivers are designed to achieve high spurious-free dynamic range (SFDR), typically in the 90–110 dB range, enabling detection of weak signals in the presence of strong interferers. For example, a 6–18 GHz receiver with 500 MHz bandwidth and a ~5 dB noise figure yields a noise floor near −82 dBm, with minimum detectable signals around −72 dBm when accounting for detection margin. To meet these requirements, wideband low-noise amplifiers must maintain 2–3 dB Noise Figures with minimal Gain variation, while also delivering high linearity, often with Third-order Intercept Points near +30 dBm and compression points around +20 dBm, requiring careful matching, biasing and thermal design.

Here are the core challenges engineers must solve:

Gain Flatness Across Frequency

Maintaining Gain flatness across frequency is a key challenge in wideband EW design. Amplifiers inherently exhibit Gain variation over frequency, which becomes more pronounced as bandwidth increases, leading to uneven signal response and potential distortion. Addressing this requires carefully engineered matching networks and equalization techniques to stabilize performance across the operating range. In EW systems, inconsistent Gain can degrade signal fidelity, resulting in missed detections or reduced jamming effectiveness.

Linearity Over Wide Bandwidth

Maintaining linearity over wide bandwidths is another critical challenge in EW system design. Wideband signals often contain multiple simultaneous tones and complex modulations, increasing the likelihood of nonlinear behavior in RF components. This nonlinearity generates intermodulation distortion (IMD) and spectral regrowth, which can degrade overall system performance. In practice, distortion can mask weak signals, reduce the effectiveness of jamming operations and even interfere with friendly systems operating within the same spectral environment.

Efficiency vs. Bandwidth Tradeoffs

Balancing efficiency and bandwidth is a fundamental tradeoff in EW system design. High efficiency is typically easier to achieve in narrowband architectures, where components can be optimized for a specific frequency range. In contrast, wideband systems often sacrifice efficiency to maintain performance across a broader spectrum. This reduced efficiency leads to increased heat generation, larger power supply requirements and degraded size, weight and power (SWaP) performance, factors that directly impact system integration and operational effectiveness.

Output Power Consistency

Maintaining consistent output power across a wide frequency range is a significant challenge in EW system design. As frequency increases, device performance often begins to degrade, making it difficult to sustain high power levels across the entire operating band. This variability can impact overall system effectiveness, particularly in jamming applications where consistent power delivery across the spectrum is essential to ensure reliable threat suppression.

Wideband RF Design Challenges in Modern EW Systems
Wideband RF design in electronic warfare systems requires balancing gain, linearity, efficiency and output power across a broad, dynamic spectrum that will ensure consistent, reliable performance in real-time, mission-critical environments.

How to Address Wideband EW Challenges

Wideband EW architectures address core RF design challenges through a combination of solid-state technologies, optimized circuit design and system-level integration. Solid-state power amplifiers and carefully engineered RF front ends enable more predictable gain behavior across wide frequency ranges, while optimized matching networks and equalization techniques help minimize variation and ensure uniform signal amplification, which reduces the risk of missed detections or degraded jamming effectiveness. The inherent predictability of these devices also supports improved linearity, and when paired with optimized biasing and system-level design, helps reduce intermodulation distortion and spectral regrowth to preserve signal integrity in dense, multi-signal environments.

At the same time, solid-state solutions help manage the tradeoffs between efficiency and bandwidth by delivering improved Power-Added Efficiency (PAE) and more consistent performance across temperature and load conditions, reducing excess heat and supporting more SWaP-efficient designs. These architectures also enable more consistent output power across wide frequency ranges, particularly when implemented in modular form factors that allow power scaling without redesigning the entire transmit chain. On the receive side, wideband low-noise amplifiers and front-end limiters protect sensitive components while maintaining stable noise figure and gain, preserving detection capability across the spectrum. Finally, integrated RF modules simplify system design, reduce assembly complexity and improve repeatability, while the inherent reliability of solid-state architectures ensures consistent performance under sustained, mission-critical operating conditions.

Conclusion

Wideband EW design is a constant balancing act—maintaining gain, linearity, efficiency and stability across a broad and dynamic spectrum, often under high power and real-time operational constraints.

By aligning device technology, integration strategy and system design with the realities of wideband operation, engineers can overcome the core challenges of modern EW, and deliver predictable, high-performance capability across the electromagnetic spectrum.

For more information about our RF solutions for wideband, high-power systems, visit our EW solutions page. Additionally, you can find more interesting collateral on this subject by visiting our Qorvo Design Hub for a rich assortment of videos, technical articles, white papers, tools and more. For technical support, please visit Qorvo.com or reach out to Technical Support.

There was a time when power engineers and RF engineers occupied different ends of the hallway.

The RF team debated noise figure and linearity as if civilization depended on it. The power team worried about volts, amps and whether something might overheat. They shared a PCB but not always a worldview. If a spur appeared in the spectrum, it was clearly an RF problem. If something got hot, that was clearly a power problem.

Life was simpler then.

Today, those hallway boundaries are dissolving. Modern converters switch fast enough that layout parasitics resemble transmission lines. Gate loops behave like resonant structures. Package inductance stops being an afterthought and starts showing up in the lab as an unexpected oscillation.

And when power management is treated casually, the PCB occasionally rewards you with a full laser-light-and-pyrotechnics show.

The oscilloscope glows with overshoot. The spectrum analyzer fills with harmonics you never budgeted for. That tidy switching node becomes a broadband radiator with impressive range and zero respect for your carefully tuned RF front end. A near-field probe appears, wielded like a fire extinguisher.

The board may not literally ignite, but it can behave as if it is auditioning for a stadium tour.

Fast edges create ringing. Poor loop control creates EMI. A little optimism in the layout can turn a clean design review into spectral damage control. Once the show begins, it is very difficult to argue that power management belongs to someone else’s discipline.

Eventually the smoke clears — metaphorically, one hopes — and the lesson becomes obvious: high frequency is no longer exclusive to the RF team.

At the same time, RF systems have grown far less tolerant of sloppy electrons. AI accelerators, phased array radars, 5G radios and satellite payloads all share a dependency on tightly controlled, dynamically managed power. We celebrate the antenna aperture, beamforming algorithms and heroic PA linearity. But none of those subsystems behave well if the supply rail resembles a suggestion rather than a specification.

Ripple becomes phase noise.
Transients become spectral regrowth.
Impedance becomes destiny.

Consider a modern phased array. Hundreds or thousands of elements must maintain phase coherence while digital control, converters and RF front ends draw from shared power domains. A transient event in one corner of the board can surface elsewhere as jitter, drift or degraded dynamic range. In high order modulation schemes, that becomes degraded EVM. In radar systems, it can mean reduced detection sensitivity.

Efficiency, in this environment, is not merely a thermal metric. It becomes an RF specification.

As systems scale, so does power density. Data centers supporting AI workloads offer a convenient illustration. We speak of “the cloud” as if it floats. In reality, it is racks of silicon pulling tightly regulated current at astonishing speed. Switching frequencies rise to shrink passives and sharpen transient response. Those faster edges introduce coupling paths and parasitics that refuse to be ignored.

The physics is indifferent. Inductance does not care whether it resides in a matching network or a buck converter. A poorly controlled current loop will radiate whether it carries a carrier wave or a switching waveform. Maxwell’s equations remain gloriously impartial.

This is where the quiet revolution in power management becomes compelling. The focus is shifting from delivering power to managing it intelligently. Adaptive control loops respond in real time. Power domains are segmented to isolate sensitive circuits. Integration reduces loop area and parasitic uncertainty. Packaging and layout are treated as electromagnetic structures, not mechanical necessities.

In other words, power design increasingly looks like RF design — just with larger currents and fewer Smith charts.

For microwave engineers, this convergence is both challenge and opportunity. The electromagnetic environment inside modern systems is crowded. High di/dt edges, dense routing and compact integration leave little margin for wishful thinking. Power integrity analysis belongs in the same conversation as S-parameters and stability circles.

The opportunity is equally clear. RF engineers already think in terms of impedance, resonance and coupling. Applying that intuition to power distribution networks and switching loops can elevate overall system performance. When the supply rail is treated as part of the signal chain rather than background infrastructure, the architecture becomes more predictable and more robust.

Power management is no longer the quiet corner of the board that “just has to work.” In high performance infrastructure, aerospace and defense systems, it is a lever for differentiation. A well-managed power architecture enables higher linearity, lower noise floors and tighter timing margins. It allows RF subsystems to operate closer to their limits without being sabotaged by their own energy source.

We often talk about pushing the boundaries of frequency. Just as important is pushing the boundaries of how precisely we manage the energy that makes those frequencies possible.

The best light show, after all, is the one that never makes it past the layout review.

This article first appeared in Brent’s Musings in Microwave Journal.

In massive warehouses and factories around the world, fleets of autonomous guided vehicles (AGVs) and autonomous mobile robots (AMRs) are transforming the way goods move from shelf to shipment. Productivity can soar by 300%, but a single human step into the robot work zone can bring the entire operation to a halt. Every pause for safety costs time, money and momentum.

That’s the challenge Redpoint Positioning set out to solve—and they’re solving it with Qorvo Ultra-Wideband (UWB) technology.

The Challenge: Safety Without Shutdown

“For large-scale automated warehouses, efficiency and safety have always been in tension,” explains John Calcio, Vice President of Partnerships at Redpoint Positioning. “If a technician needs to enter an AGV zone, regulations require shutting down every robot in the area. It’s safe—but it’s also massively inefficient.”

High-volume warehouse environments may deploy thousands of fast-moving robots working side-by-side with human crews. Maintaining over 99% reliability in such a dynamic, high-density space is critical, particularly when functional safety standards like SIL2 (Safety Integrity Level 2) must be met.

“The easiest way to stay compliant is to stop everything,” Calcio says. “But that’s a brute-force solution. We knew we could do better with real-time, centimeter-level awareness.”

The Redpoint Solution: Real-Time Location, Real-Time Safety

Redpoint’s real-time location system (RTLS) integrates directly into AGVs and wearable safety gear. Each robot and worker is equipped with a UWB tag that continuously tracks its position with centimeter-level accuracy and millisecond latency. When a worker enters a restricted zone, nearby robots automatically slow or stop—without requiring a full fleet shutdown.

“Think of it as indoor GPS,” Calcio explains. “Our technology lets machines and people ‘see’ each other in real time, even in environments where Wi-Fi or vision systems struggle. It’s fast enough that a forklift can slow down or reroute before a collision is possible.”

The result is a SIL2-compliant wireless safety system that keeps both people and production moving.

A graphic of a smart factory
 

High-volume warehouses rely on Redpoint’s RTLS to help people and robots see each other in real time, delivering over 99% reliability and meeting strict SIL2 functional safety requirements.
 

Why Qorvo UWB

At the heart of Redpoint’s RTLS is Qorvo’s UWB technology. With its low power consumption, precision ranging and robust performance in congested RF environments, Qorvo UWB provides the foundation Redpoint needed to meet industrial-scale performance and safety goals.

“Qorvo’s UWB delivers exactly what these environments demand—centimeter-level accuracy, millisecond response and exceptional reliability in complex, high-density deployments,” says Percy Yu, Qorvo Regional Marketing Manager in China. “Redpoint has been a long-term partner of Qorvo—over seven years now—and they’ve built on our UWB platform to create a proven, safety-certified RTLS solution.”

That partnership has already paid dividends: Redpoint’s system now powers tens of thousands of AGVs worldwide, improving operational efficiency by an average of 4–5%, with up to 15% increases in operator productivity and a 95% reduction in workplace accidents.

“These numbers may sound modest,” Calcio notes, “but when you’re talking about multi-million-square-foot facilities, a few percentage points translate to tens of millions of dollars in savings.”

Scaling Up—and Out

One of Redpoint’s key differentiators is scalability. Their RTLS solution is purpose-built for environments where hundreds or thousands of moving assets share the same wireless space.

“When you have that many nodes transmitting position data at once, congestion and interference can become real issues,” says Calcio. “We engineered custom wireless protocols to keep latency and reliability at SIL2 standards, even in massive deployments.”

And that scalability isn’t limited to warehouses. Redpoint’s technology is now being adopted in industries ranging from logistics to mining—and they’re not alone in this UWB-powered expansion.

Tsingoal: Widening the Field

In China, Tsingoal—the country’s largest RTLS solution provider—is leveraging Qorvo UWB across a diverse portfolio that includes robotics control, factory automation, mining, logistics, parking systems and smart city infrastructure. Tsingoal’s UWB-based systems provide real-time tracking of assets, vehicles and personnel, improving safety, workflow efficiency and spatial awareness across industrial and urban environments.

From intelligent manufacturing lines to airport logistics and even humanoid robotics demonstrations, Tsingoal’s implementations showcase the versatility of Qorvo’s UWB technology in complex, multi-layered operations.

Building the Future of Intelligent Automation

Both Redpoint and Tsingoal exemplify how Qorvo’s UWB technology is enabling a new generation of connected, intelligent and safer industrial ecosystems.

“What’s exciting,” says Yu, “is that we’re seeing global adoption. From North America to Asia, companies are realizing that UWB isn’t just about precision—it’s about trust, reliability and safety at scale.”

Calcio agrees. “This is where the market is going. The future of automation depends on real-time awareness—and that starts with UWB.”

Find out more about Qorvo UWB solutions here.

Danalto

Dublin, Ireland – February 11, 2026 – Danalto, a pioneer in location intelligence software, today announced the successful integration of Danalto’s Cardinal™ Cloud Location Engine (CLE) with Qorvo’s latest Ultra-Wideband (UWB) System-on-Chip (SoC) and industrial and enterprise SDK.

This milestone brings enterprise customers one step closer to scalable, cloud-first UWB Real-Time Location System (RTLS) solutions capable of powering next-generation asset tracking, indoor navigation, and smart facility applications.

By combining Qorvo’s UWB performance with Danalto’s cloud-native multi-technology positioning framework, developers and integrators can now evaluate and prototype high-accuracy location services with reduced integration complexity and enhanced scalability.

“The Cardinal framework’s compatibility with Qorvo’s SDK and SoC opens exciting possibilities for UWB adoption in enterprise environments,” said Finbarr Coghlan, Chief Product Officer at Danalto. “It’s a strong foundation for future solutions that combine ease of deployment with precision performance.”

“We’re enabling our ecosystem partners to innovate faster with proven UWB silicon and a robust software platform,” said Nicolas Layus, general manager of Integrated Systems at Qorvo. “Our proven UWB combination lays the groundwork for flexible RTLS architectures that can adapt to evolving enterprise needs.”

About Danalto
Danalto provides physical AI and cloud-based positioning intelligence that enables enterprise customers to deploy real-time location services using multiple positioning technologies. Learn more at www.danalto.com.

Across defense and aerospace programs, the expectations placed on RF power systems continue to intensify. Radar, SATCOM, electronic warfare (EW) and high-duty test environments demand various combinations of higher output power, wider bandwidth, improved linearity and increased operational reliability—often within shrinking size, weight and power consumption (SWaP) constraints.

These pressures create a set of design challenges that legacy RF power architectures can no longer solve. As programs evolve and timelines compress, engineering teams must rethink how they generate and manage RF power at the system level. The challenges include:

    • The Need for Wideband, High-Duty Power
      Next-generation radar, SATCOM and EW systems increasingly operate across multiple frequency bands—S, C, X, Ku, K and Ka—and need to support both continuous-wave (CW) and high-duty-cycle pulsed operation. This shift places significant demands on RF power architectures, which must deliver high output power across broad bandwidths while maintaining stable performance under continuous or near-continuous operating conditions. At the same time, these systems must manage elevated power densities without compromising thermal efficiency. While traditional RF power combining architectures can generate the required power, they often struggle to provide the duty-cycle flexibility, efficiency and thermal robustness needed in modern wideband applications.
    • Reliability and Lifecycle Expectations Are Rising
      Across ground, airborne and shipborne platforms, reliability expectations continue to climb. Modern systems require amplifiers with high mean time between failures (MTBF), predictable long-term performance and the ability to operate reliably under harsh environmental and mission conditions. Reducing maintenance cycles and enabling easier field replacement are now essential to maintaining readiness and controlling lifecycle costs. However, systems built around aging traveling wave tube amplifiers (TWTAs) face increasing challenges, including supply-chain constraints, end-of-life component issues and rising sustainment risk as tube technologies become more difficult to source and support.
    • SWaP-C Is Now a System-Level Constraint
      System integrators are under pressure to reduce size, weight, power consumption and cost—collectively known as SWaP-C—across entire subsystems. Amplifiers that are physically large, thermally inefficient or dependent on multiple external components can have cascading impacts throughout the design. These inefficiencies often increase the size and complexity of power supplies, cooling systems and mechanical enclosures, while also extending qualification and certification timelines. As system architectures evolve, high-density, thermally optimized amplification solutions are becoming essential to meeting program-level SWaP-C requirements.
    • Integration Complexity Slows Program Schedules
      Many existing RF power solutions require multiple external elements, such as separate driver stages, bias control boards and protection circuitry. Each additional component increases design effort, introduces more potential failure points, adds new qualification steps and ultimately extends program schedules. As timelines compress and system architectures converge, engineering teams need amplification solutions that reduce the number of external modules and streamline system-level validation. Simplified, pre-integrated designs can meaningfully shorten development cycles and reduce overall program risk.

Half the size, Built for the Mission

Qorvo’s newest SSPAs enable up to 50 percent smaller and one-third lighter system-level solutions compared to legacy traveling wave tube amplifiers (TWTAs), supporting mission continuity and long-term reliability in demanding RF environments.

QPR3238_PDP

QPR3238: 32-38 GHz Wideband GaN SSPA Module

Spatium Qpb1840N

QPB2040N: 18-40 GHz Wideband GaN SSPA

Design Challenges in RF Power Systems

What an Ideal Next-Generation Wideband SSPA Solution Should Deliver

To address these challenges, a next-generation RF power amplifier must provide a combination of efficiency, reliability, integration and long-term availability that aligns with modern program requirements.

    • High Efficiency at High Power
      An effective solution must offer robust output power across S–Ka bands, maintain consistent efficiency under both CW and high-duty-cycle operation and minimize heat generation to simplify thermal design. High efficiency directly reduces cooling requirements and enables smaller, lighter system architectures.
    • Proven Reliability in Harsh Conditions
      Next-generation systems require ruggedized packaging, robust thermal paths and amplifier architectures capable of achieving high MTBF with predictable end-of-life behavior. Solutions must withstand vibration, shock and environmental stressors to ensure consistent performance across diverse mission environments.
    • SWaP-C Optimization at the System Level
      Ideal architectures offer compact form factors, lower system weight and improved thermal performance that enables smaller cooling subsystems. By consuming less power and reducing thermal load, such solutions help decrease operating costs while streamlining overall subsystem design.
    • Integrated Functional Blocks
      Modern SSPAs should incorporate built-in bias control, integrated driver stages and a pre-aligned RF chain that simplifies system qualification. A one-module approach reduces design complexity, lowers integration risk and accelerates schedules by minimizing the number of separate components that must be sourced, tested and validated.
  • Supply Chain Stability and Long-Term Availability
    Finally, next-generation RF power solutions must be supported by stable manufacturing, minimized obsolescence risk and scalable production capacity suitable for full-rate defense and aerospace programs. Long-term availability is critical to ensuring sustainment, modernization and program continuity.

Next-Generation RF Power Amplifiers Must Provide
These performance, reliability and integration expectations are increasingly difficult to meet with vacuum-tube technologies or lower-efficiency planar SSPAs—driving an industry-wide shift toward more advanced, wideband solid-state architectures.

Wideband GaN-on-SiC SSPAs: Improving Power Density, Thermal Performance and System Reliability

Among the various solid-state approaches available today, Qorvo’s wideband GaN-based amplifier technologies—including implementations that use spatial combining techniques—provide a practical illustration of how modern SSPA architectures can address the performance, reliability and integration needs described above. These solutions demonstrate how wideband GaN devices, efficient power combining and integrated control functions can be applied to meet system-level requirements across radar, SATCOM, EW and test environments.

Qorvo’s approach brings several characteristics that directly map to the needs of today’s radar, SATCOM and EW systems:

    • Wideband, high-efficiency RF output across S-, C-, X-, Ku-, K- and Ka-bands
    • High reliability and long MTBF due to GaN-on-SiC technology and ruggedized module construction
    • Optimized SWaP-C at the total solution level, often replacing TWTA-based systems with smaller, lighter alternatives
    • Integrated bias control and driver stages for ease of system integration
    • Pre-tested, pre-aligned modules that shorten qualification timelines
  • A proven, scalable platform supported by vertically integrated manufacturing

These characteristics make Qorvo solutions suitable for replacing aging TWTAs, improving system reliability and meeting the performance and SWaP-C expectations of modern defense and aerospace programs.

 

Wideband High-Power Spatium SSPAs vs Legacy TWTAs

Conclusion

Modern RF systems demand more than incremental improvements—they require amplifier architectures that are efficient, reliable, broadband and simple to integrate. As TWTAs face supply limitations and higher sustainment costs, solid-state technology provides a compelling path forward. Solutions that combine high power, broad bandwidth, integrated functionality and rugged reliability will define the next generation of radar, EW, SATCOM and test platforms.

Qorvo’s GaN-based amplifier solutions are engineered to meet these exact demands, providing a field-proven, scalable technology path for programs seeking to modernize their RF power infrastructure.

For more information, read our press release on Qorvo’s new Spatium SSPAs replacing legacy TWTAs. Qorvo’s newest SSPAs enable up to 50 percent smaller and one-third lighter system-level solutions compared to legacy traveling wave tube amplifiers (TWTAs), supporting mission continuity and long-term reliability in demanding RF environments.

To learn more about Qorvo’s trusted RF solutions for defense and aerospace—including Spatium SSPAs and GaN-based front ends, visit www.qorvo.com/spatiumsspa.

 

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Across defense and aerospace programs, the expectations placed on RF power systems continue to intensify. Radar, SATCOM, electronic warfare (EW) and high-duty test environments demand various combinations of higher output power, wider bandwidth, improved linearity and increased operational reliability—often within shrinking size, weight and power consumption (SWaP) constraints.

These pressures create a set of design challenges that legacy RF power architectures can no longer solve. As programs evolve and timelines compress, engineering teams must rethink how they generate and manage RF power at the system level. The challenges include:

    • The Need for Wideband, High-Duty Power
      Next-generation radar, SATCOM and EW systems increasingly operate across multiple frequency bands—S, C, X, Ku, K and Ka—and need to support both continuous-wave (CW) and high-duty-cycle pulsed operation. This shift places significant demands on RF power architectures, which must deliver high output power across broad bandwidths while maintaining stable performance under continuous or near-continuous operating conditions. At the same time, these systems must manage elevated power densities without compromising thermal efficiency. While traditional RF power combining architectures can generate the required power, they often struggle to provide the duty-cycle flexibility, efficiency and thermal robustness needed in modern wideband applications.
    • Reliability and Lifecycle Expectations Are Rising
      Across ground, airborne and shipborne platforms, reliability expectations continue to climb. Modern systems require amplifiers with high mean time between failures (MTBF), predictable long-term performance and the ability to operate reliably under harsh environmental and mission conditions. Reducing maintenance cycles and enabling easier field replacement are now essential to maintaining readiness and controlling lifecycle costs. However, systems built around aging traveling wave tube amplifiers (TWTAs) face increasing challenges, including supply-chain constraints, end-of-life component issues and rising sustainment risk as tube technologies become more difficult to source and support.
    • SWaP-C Is Now a System-Level Constraint
      System integrators are under pressure to reduce size, weight, power consumption and cost—collectively known as SWaP-C—across entire subsystems. Amplifiers that are physically large, thermally inefficient or dependent on multiple external components can have cascading impacts throughout the design. These inefficiencies often increase the size and complexity of power supplies, cooling systems and mechanical enclosures, while also extending qualification and certification timelines. As system architectures evolve, high-density, thermally optimized amplification solutions are becoming essential to meeting program-level SWaP-C requirements.
    • Integration Complexity Slows Program Schedules
      Many existing RF power solutions require multiple external elements, such as separate driver stages, bias control boards and protection circuitry. Each additional component increases design effort, introduces more potential failure points, adds new qualification steps and ultimately extends program schedules. As timelines compress and system architectures converge, engineering teams need amplification solutions that reduce the number of external modules and streamline system-level validation. Simplified, pre-integrated designs can meaningfully shorten development cycles and reduce overall program risk.

Design Challenges in RF Power Systems

What an Ideal Next-Generation Wideband SSPA Solution Should Deliver

To address these challenges, a next-generation RF power amplifier must provide a combination of efficiency, reliability, integration and long-term availability that aligns with modern program requirements.

    • High Efficiency at High Power
      An effective solution must offer robust output power across S–Ka bands, maintain consistent efficiency under both CW and high-duty-cycle operation and minimize heat generation to simplify thermal design. High efficiency directly reduces cooling requirements and enables smaller, lighter system architectures.
    • Proven Reliability in Harsh Conditions
      Next-generation systems require ruggedized packaging, robust thermal paths and amplifier architectures capable of achieving high MTBF with predictable end-of-life behavior. Solutions must withstand vibration, shock and environmental stressors to ensure consistent performance across diverse mission environments.
    • SWaP-C Optimization at the System Level
      Ideal architectures offer compact form factors, lower system weight and improved thermal performance that enables smaller cooling subsystems. By consuming less power and reducing thermal load, such solutions help decrease operating costs while streamlining overall subsystem design.
    • Integrated Functional Blocks
      Modern SSPAs should incorporate built-in bias control, integrated driver stages and a pre-aligned RF chain that simplifies system qualification. A one-module approach reduces design complexity, lowers integration risk and accelerates schedules by minimizing the number of separate components that must be sourced, tested and validated.
  • Supply Chain Stability and Long-Term Availability
    Finally, next-generation RF power solutions must be supported by stable manufacturing, minimized obsolescence risk and scalable production capacity suitable for full-rate defense and aerospace programs. Long-term availability is critical to ensuring sustainment, modernization and program continuity.

Next-Generation RF Power Amplifiers Must Provide
These performance, reliability and integration expectations are increasingly difficult to meet with vacuum-tube technologies or lower-efficiency planar SSPAs—driving an industry-wide shift toward more advanced, wideband solid-state architectures.

Wideband GaN-on-SiC SSPAs: Improving Power Density, Thermal Performance and System Reliability

Among the various solid-state approaches available today, Qorvo’s wideband GaN-based amplifier technologies—including implementations that use spatial combining techniques—provide a practical illustration of how modern SSPA architectures can address the performance, reliability and integration needs described above. These solutions demonstrate how wideband GaN devices, efficient power combining and integrated control functions can be applied to meet system-level requirements across radar, SATCOM, EW and test environments.

Qorvo’s approach brings several characteristics that directly map to the needs of today’s radar, SATCOM and EW systems:

    • Wideband, high-efficiency RF output across S-, C-, X-, Ku-, K- and Ka-bands
    • High reliability and long MTBF due to GaN-on-SiC technology and ruggedized module construction
    • Optimized SWaP-C at the total solution level, often replacing TWTA-based systems with smaller, lighter alternatives
    • Integrated bias control and driver stages for ease of system integration
    • Pre-tested, pre-aligned modules that shorten qualification timelines
  • A proven, scalable platform supported by vertically integrated manufacturing

These characteristics make Qorvo solutions suitable for replacing aging TWTAs, improving system reliability and meeting the performance and SWaP-C expectations of modern defense and aerospace programs.

Conclusion

Modern RF systems demand more than incremental improvements—they require amplifier architectures that are efficient, reliable, broadband and simple to integrate. As TWTAs face supply limitations and higher sustainment costs, solid-state technology provides a compelling path forward. Solutions that combine high power, broad bandwidth, integrated functionality and rugged reliability will define the next generation of radar, EW, SATCOM and test platforms.

Qorvo’s GaN-based amplifier solutions are engineered to meet these exact demands, providing a field-proven, scalable technology path for programs seeking to modernize their RF power infrastructure.

For more information, read our latest press release announcing Qorvo’s newest SSPAs enable up to 50 percent smaller and one-third lighter system-level solutions compared to legacy traveling wave tube amplifiers (TWTAs), supporting mission continuity and long-term reliability in demanding RF environments.

To learn more about Qorvo’s trusted RF solutions for defense and aerospace—including Spatium SSPAs and GaN-based front ends, visit www.qorvo.com/spatiumsspa.