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BENGALURU, India and AUSTIN, Texas, May 21, 2026 /PRNewswire/ — Comminent®, an innovator in next-generation IoT communication network platforms, and Silicon Labs (NASDAQ: SLAB), the leading innovator in low-power wireless, today announced a major milestone for India’s smart grid infrastructure with the successful shipment of over 500,000 Wi-SUN-compliant communication modules powered by Silicon Labs’ EFR32FG28 Wireless SoC.

Scaling Wi-SUN for India’s Smart Grid Modernization
India’s Revamped Distribution Sector Scheme (RDSS) is driving one of the world’s largest infrastructure transformations. To support this ambitious smart meter rollout, the Bureau of Indian Standards (BIS) officially adopted the global Wi-SUN Field Area Network (FAN) specification (IEEE 2857-2021 and ISO/IEC/IEEE 32857:2026) as the national standard (IS 18010) for smart meter RF communication networks. This standardization ensures secure, interoperable wireless mesh networks for large-scale Advanced Metering Infrastructure (AMI), smart cities, and IoT applications.

“Comminent’s 500,000-unit milestone highlights the growing adoption of Wi-SUN in large-scale deployments,” said Ross Sabolcik, Senior Vice President of Product Lines at Silicon Labs. “We are proud to partner with Comminent to provide the robust, scalable, and highly secure underlying technology needed to support India’s ambitious grid modernization efforts and deliver reliable connectivity to millions.”

Solving Complex Deployment Challenges at Scale
Comminent’s deep focus on solving India’s complex deployment challenges is central to delivering scalable and reliable rollouts. As utilities move closer to real-time monitoring and grid resilience, interoperable and self-healing networks like Wi-SUN are functioning as the primary infrastructure for large-scale deployment.

“India’s smart metering rollout is one of the largest infrastructure transformations, and this milestone reflects the growing shift toward scalable, utility-grade communication networks like Wi-SUN,” said Amarjeet Kumar, Founder & CEO of Comminent. “Our collaboration with Silicon Labs strengthens our ability to deliver high-performance communication modules engineered for advanced smart grid deployments.”

Built on the EFR32FG28 Wireless SoC for Resilient, Utility-Grade Connectivity
To meet these demands, Comminent’s communication module is powered by Silicon Labs’ EFR32FG28 Wireless SoC, architected specifically for large-scale smart grid and industrial IoT applications. The EFR32FG28 platform enables reliable, long-range connectivity in demanding field environments, offering key advantages including:

  • Optimized Dual-Band Connectivity: Combines a high-performance, long-range Sub-GHz radio optimized for India’s RF environment with a 2.4 GHz Bluetooth LE radio for increased design flexibility.
  • Resilient Processing & Infrastructure: Features a high-performance multi-core architecture with dedicated ARM cores for application processing, radio, and edge intelligence, complemented by ample memory to deliver robust mesh networking performance in dense urban and geographically distributed deployments.
  • Enterprise-Grade Security: Powered by Silicon Labs’ Secure Vault™ technology with PSA Level 3 certification, delivering secure key storage, anti-tamper capabilities, and advanced hardware cryptographic acceleration.

This combination enables utilities to deploy scalable, secure, and future-ready Wi-SUN networks capable of supporting millions of endpoints. With capabilities proven in India’s large-scale deployments, Comminent is expanding into global smart grid markets, including the United States, Japan, and emerging energy-transition regions.

To learn more about how Silicon Labs is powering the next generation of smart grids, explore the EFR32FG28 Wireless SoC and our Wi-SUN solutions.

About Comminent
Comminent Pvt Ltd, headquartered in Bengaluru, Karnataka, offers IPv6-compliant open standards-based machine-to-machine (M2M) communication solutions that are device agnostic and built to provide high reliability. The company’s state-of-the-art device management platform is powered by AI/ML tools combined with edge-computing technologies to ensure faster decision-making and trigger control actions based on predefined policies. Comminent has proven expertise in large-scale IoT networks, providing a variety of communication solutions and engineering tools to silicon vendors, module and product OEMs, system integrators, and service providers.

About Silicon Labs
Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power connectivity, building embedded technology that connects devices and improves lives. Merging cutting-edge technology into the world’s most highly integrated SoCs, Silicon Labs provides device makers with the solutions, support, and ecosystems needed to create advanced edge connectivity applications. Headquartered in Austin, Texas, Silicon Labs has operations in over 16 countries and is the trusted partner for innovative solutions in smart home, industrial IoT, and smart cities markets. Learn more at https://www.silabs.com.

SOURCE Silicon Labs

AUSTIN, Texas, April 30, 2026 /PRNewswire/ — Silicon Labs (NASDAQ: SLAB), the leading innovator in low-power wireless, today announced the promotion of Dr. Aslam Rafi to Senior Fellow. The Senior Fellow designation represents the highest level of technical achievement at Silicon Labs, recognizing individuals whose sustained innovation and leadership have materially shaped the company’s technology and long-term strategy.

“Aslam represents the highest standard of technical excellence at Silicon Labs,” said Daniel Cooley, Senior Vice President and Chief Technology Officer at Silicon Labs. “His work has fundamentally shaped our wireless leadership, and this promotion reflects both the scale of his impact and the critical role he continues to play in defining our future.”

Dr. Rafi has been with Silicon Labs for 26 years, driving foundational advancements in RF and analog technologies across a broad set of end markets, including cellular, broadcast, timing, and IoT wireless applications. His innovations deliver industry-leading performance and are embedded across virtually all Silicon Labs products.

Dr. Rafi has authored over 112 patents and has published in leading forums, including the IEEE Solid-State Circuits conference, the Journal of Solid-State Circuits and the Custom Integrated Circuits Conference. Dr. Rafi holds a Ph.D. from the University of Texas at Austin, a Master of Science from Carnegie Mellon University, and a Bachelor of Science from IIT Madras.

The Senior Fellow designation is reserved for individuals whose contributions are foundational and uniquely transformative, representing the company’s most distinguished technical leaders. It is awarded through a rigorous and highly selective process, with candidates evaluated on technical mastery, impact on engineering culture, commercial success, and overall industry influence.

About Silicon Labs

Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power connectivity, building embedded technology that connects devices and improves lives. Merging cutting-edge technology into the world’s most highly integrated SoCs, Silicon Labs provides device makers with the solutions, support, and ecosystems needed to create advanced edge connectivity applications. Headquartered in Austin, Texas, Silicon Labs has operations in over 16 countries and is the trusted partner for innovative solutions in smart home, industrial IoT, and smart cities markets. Learn more at https://www.silabs.com.

For more than a decade, wireless microcontrollers (MCUs) have been evaluated primarily on radio performance. Range, sensitivity, protocol support, and transmit power defined leadership. These metrics still matter, but in modern IoT systems, connectivity is no longer the primary constraint. System complexity is.

Rethinking the Role of the IoT MCU

Today’s IoT products are expected to deliver more intelligence, tighter power efficiency, and faster time to market, all while reducing cost. Yet many designs still rely on multiple MCUs operating on the same board. A single device might have one MCU for connectivity, another for application control, and a third for real-time processing. And sometimes a fourth is required for sensing or device management.

This architecture persists because it’s familiar. But it’s far from optimal.

As IoT systems evolve, RF performance alone is no longer the defining metric. What matters today is how efficiently the entire system is architected.

Silicon Labs Series 2 was designed around the premise that wireless MCUs should not just connect devices, but consolidate them.

The Hidden Inefficiency in Today’s IoT Designs

A typical connected device often includes:

  • A wireless SoC for Bluetooth Low Energy (LE), Zigbee, Thread, or proprietary connectivity
  • An application MCU for control logic
  • A motor-control MCU for deterministic actuation
  • A low-power controller for sensing or housekeeping

Each additional device increases:

  • Bill-of-material cost (BOM)
  • PCB area
  • Firmware complexity
  • Validation effort
  • Inter-processor latency
  • Idle and leakage power

Ironically, much of this duplication is unnecessary. Wireless workloads are event-driven and burst-based. In many systems, the connectivity stack consumes a fraction of available CPU cycles. The processor becomes active during packet handling, then remains idle for extended intervals.

This creates a structural inefficiency. Significant compute headroom remains unused while additional MCUs are added elsewhere on the board. This presents an opportunity to reclaim that headroom and consolidate system functionality without compromising wireless performance.

Consolidation Only Works if Isolation is Guaranteed

The primary reason many systems remain partitioned is concern. Engineers hesitate to combine workloads for fear of degrading wireless determinism or introducing timing jitter into real-time tasks.

Silicon Labs Series 2 addresses this directly. It employs a multicore, event-driven architecture with functional separation:

  • Dedicated cores manage radio and security operations
  • Latency-critical wireless tasks execute independently
  • The application core remains available for control, sensing, and AI workloads

This separation ensures that adding application functionality does not degrade wireless performance or real-time behavior. Instead of protecting RF integrity through partitioning, designers can now protect it through architecture.

Event-Driven Compute: Doing More with Less Power

Reducing component count is only part of the system equation. Power efficiency is equally critical. Traditional MCU-based systems rely heavily on CPU intervention. Interrupt-driven designs wake the processor frequently, increasing dynamic power consumption and adding software overhead.

Series 2 takes a fundamentally different approach.

Its Peripheral Reflex System enables peripherals to communicate directly with one another. Hardware events trigger hardware responses. Data can move through DMA pathways without waking the CPU.

For example:

  • An ADC conversion can automatically initiate a memory transfer
  • A comparator event can directly adjust a PWM output
  • Timers can coordinate control loops autonomously

The processor wakes only when meaningful computation is required. This architecture delivers:

  • Lower dynamic power consumption
  • Deterministic real-time behavior
  • Higher effective compute utilization

More work is done in hardware, so less energy is spent orchestrating it in software. In battery-powered and energy-sensitive systems, this is a structural advantage.

Real-Time Control and Connectivity on One Chip

Motor control illustrates the consolidation challenge clearly.

Closed-loop Field-Oriented Control (FoC) demands precise timing, high-speed ADC sampling, and coordinated PWM updates. Historically, this required a dedicated MCU to guarantee deterministic performance.

Series 2 challenges that assumption.

By combining advanced PWM peripherals, high-performance ADCs, hardware-based event routing, and efficient Arm Cortex-M33 processing, Series 2 can execute closed-loop FoC while simultaneously maintaining a Bluetooth LE stack on the same device.

This enables:

  • Single-chip motor and wireless designs
  • Reduced system latency
  • Simplified firmware architecture
  • Lower PCB complexity

For customers, the impact is direct:

  • BOM reduction
  • Lower power consumption
  • Shorter validation cycles
  • Faster time to market

The economics of intelligent devices shift when real-time control and connectivity coexist on one platform.

Embedded AI Without Additional Silicon

The next generation of IoT systems requires local intelligence. Sensor fusion, anomaly detection, predictive maintenance, and signal classification are increasingly moving from cloud to edge.

Traditional approaches add hardware. External NPUs or larger application processors increase cost, board space, and power complexity.

Series 2 integrates a Matrix Vector Processor (MVP) optimized for linear algebra, DSP workloads, and neural network inference.

By offloading math-intensive operations:

  • CPU cycles remain available for control and connectivity
  • Inference latency becomes predictable
  • Energy per inference is significantly reduced

AI becomes a native system capability rather than an architectural add-on. Intelligence is integrated, not appended.

Platform Consistency That Scales

Architectural consistency is as important as performance.

Series 2 capabilities extend across Bluetooth, multiprotocol, sub-GHz, and proprietary families. Motor-control peripherals, AI acceleration, event routing, and security architecture are shared across the portfolio.

This enables:

  • Software reuse across product variants
  • Reduced SKU proliferation
  • Simplified qualification processes
  • Faster feature scaling

As organizations expand product lines or enter adjacent markets, a consistent platform reduces both technical and operational friction. Platform continuity becomes a multiplier for engineering productivity.

Connectivity is No Longer the Edge of the System, It’s at The Center

Many vendors approach connectivity by adding radios to traditional MCU architectures.

Series 2 takes the opposite path by absorbing application compute, control logic, and AI into the wireless platform itself. Instead of adding features through more silicon, the objective becomes removing silicon entirely.

In modern IoT systems, leadership will be measured by:

  • How many components can be eliminated
  • How efficiently compute headroom is utilized
  • How intelligently power is managed
  • How seamlessly functionality scales

A New Definition of the Wireless MCU

Series 2 redefines what a wireless MCU can be. A connectivity platform, an application processor, a real-time control engine, and an embedded AI accelerator. All within a single, power-efficient architecture optimized for real-world IoT systems.

As IoT architectures continue to consolidate, the question is no longer whether wireless MCUs should do more.

The real question becomes, how efficiently can they replace the rest of the system?

Series 2 was designed for this future from day one.

In modern IoT design, the most valuable innovation may not be what is added to the board, but what can finally be removed.

IoT deployments are moving from pilot programs to scaled rollouts, and the conversation is changing.

As deployments scale, different application tiers demand different optimization points. High-end platforms are built to manage complex, multiprotocol, and mesh networking environments. Broad-market deployments, however, prioritize streamlined capability—long-range, multi-year battery life, deterministic responsiveness, built-in security, and cost structures aligned with volume production.

That’s the design philosophy behind Silicon Labs’ EFR32FG23L sub-GHz wireless SoC.

Sub-GHz Wireless: Designed for Structured, Real-World Architectures

Many high-volume sub-GHz systems follow structured topologies such as sensor-to-gateway, remote-to-controller, and endpoint-to-hub. These are not massive mesh networks, but purpose-built wireless links that prioritize predictability, fast response, and architectural simplicity.

Designing Large Scale Sub-GHz Wireless Systems Requires Discipline

The EFR32FG23L SoC was built specifically for these types of deployments. Rather than carrying the overhead of multiprotocol stacks intended for complex network coordination, FG23L delivers a streamlined architecture optimized for proprietary and star network topologies. The result is a tightly integrated platform that balances performance, memory footprint, and cost efficiency.

This approach allows developers to focus on what matters most: building responsive, reliable wireless products without paying for silicon they don’t need.

Extending Sub-GHz Wireless Range Where It Matters

Sub-GHz connectivity continues to be the preferred choice for applications that demand deep penetration, extended coverage, and reliable performance in challenging RF environments.

From industrial campuses and agricultural fields to commercial buildings and residential perimeters, longer range directly impacts system economics. Fewer gateways. Simplified installation. Lower infrastructure costs.

The FG23L SoC supports global sub-GHz bands and delivers a strong link budget that enables robust connectivity across diverse deployment scenarios. Whether navigating dense industrial structures or covering wide outdoor spaces, the device is engineered to maintain reliable communication over distance.

In this context, range is just as much a business enabler as an RF metric.

Deterministic Communication for Responsive Systems

In many sub-GHz applications, timing is everything.

A remote key fob has to respond instantly, an access control system needs to be authenticated without delay, and an industrial safety trigger cannot tolerate uncertainty.

These use cases demand deterministic, low-latency communication rather than complex routing protocols. By leveraging Silicon Labs’ RAIL (Radio Abstraction Interface Layer), developers can implement custom PHY and MAC layers that are optimized for responsiveness and efficiency. This flexibility allows precise control over airtime, data rate, and power consumption assuring predictable system behavior.

For designers building proprietary wireless systems, this level of control is often more valuable than protocol breadth.

Power Efficiency That Enables Large Scale IoT

Battery life remains one of the defining constraints in IoT design. Maintenance costs, service intervals, and user experience are all shaped by energy consumption.

The FG23L SoC is engineered to support multi-year battery operation across a wide range of endpoint devices. Its low sleep currents, fast wake-up capabilities, and intelligent low-power listening modes allow systems to remain energy-efficient without sacrificing responsiveness.

From security sensors and smart agriculture nodes to consumer remotes and monitoring devices, efficient power design directly reduces operational costs and supports large-scale deployment models.

At scale, every microamp matters.

Security as a Foundation, Not an Afterthought

As IoT devices proliferate across industrial and residential environments, security expectations rise. Device identity, encrypted communication, and secure firmware management are baseline requirements.

The FG23L integrates Secure Vault™ embedding hardware-rooted security directly into the device architecture. Secure boot, hardware-accelerated cryptography, secure debug capabilities, and advanced protection mechanisms provide a strong foundation without requiring external security components.

By integrating security at the silicon level, developers can meet modern protection requirements while maintaining cost and design efficiency.

Multicore Architecture and Integration That Simplifies System Design

With dedicated cores for application, radio, and secure engine, the FG23L SoC provides ample compute headroom to minimize protocol and application processing latency, ensuring responsive sub-GHz wireless communication.

In cost-sensitive designs, integration drives advantage, and the FG23L brings together a rich set of analog and digital peripherals to support real-world product requirements, including precision data acquisition, autonomous sensing, flexible communication interfaces, and extensive GPIO to enable compact, single-chip solutions.

Higher integration also reduces external components, simplifies PCB layout, and accelerates development cycles. For manufacturers targeting competitive markets, these efficiencies translate directly into lower total system cost and faster time to market.

FG23L Sub-GHz SoC: Built for Broad-Market Opportunity

Sub-GHz technology continues to expand beyond traditional industrial niches into commercial infrastructure and home automation ecosystems. Wireless I/O modules, condition monitoring systems, building automation platforms, lighting control, access systems, smart locks, perimeter sensors, and remote-control devices all share a common set of requirements: structured communication, long-range reliability, battery-powered operation, hardware-rooted security, and cost alignment for volume deployment.

The FG23L was designed precisely to meet these design requirements.

FG23L Applications

Focused Capability for the Next Phase of Sub-GHz IoT Growth

The future of sub-GHz IoT growth won’t be driven by maximum feature density as much as by focused capability and devices that deliver the performance designers need while eliminating unnecessary overhead.

The FG23L sub-GHz wireless SoC embodies this trend, combining low cost, long-range connectivity, deterministic communication, integrated security, ultra-low power operation, and streamlined memory into a cost-optimized platform tailored for scale.

As IoT continues its transition from specialized deployments to mainstream infrastructure, right-sized wireless solutions will define competitive advantage.

Motors power billions of devices across homes, industry, agriculture, and consumer products. For decades, motor architectures were optimized around one primary objective: control performance. Connectivity, analytics, and intelligence were layered on only when necessary.

That model is reaching its limits because today’s motor-driven products are expected to connect, adapt, update securely, and respond intelligently to changing conditions. They’re no longer isolated control nodes, but intelligent endpoints within broader digital systems. This evolution requires more than better control algorithms. It requires integrated wireless, compute, and machine learning (ML) at the core of the motion system.

Silicon Labs’ MG24-based connected motor solution represents this architectural shift.

Why Traditional Motor System Architectures No Longer Scale

Historically, connected motor systems were assembled from multiple components:

  • A dedicated motor-control MCU
  • A separate wireless SoC or module
  • Optional security elements
  • Additional processors for sensing or analytics

While functional, this fragmented model increases bill of materials (BOM) cost, PCB footprint, firmware complexity, and system latency. More importantly, it divides processing responsibility across devices, making feature expansion more difficult over time.

Adding wireless commissioning, over-the-air (OTA) updates, predictive diagnostics, or anomaly detection often requires redesigning system architecture rather than extending it. At the same time, product expectations have expanded. Modern motor-driven devices must be:

  • Wirelessly connected for configuration and diagnostics
  • Secure and field-updatable
  • Capable of local analysis and intelligent response
  • Compact and energy-efficient
  • Cost-optimized for scale

Meeting all these requirements with a multi-chip approach is increasingly inefficient.

MG24: A Wireless Compute Platform for Connected Motion

MG24 Multiprotocol Wireless SoC is designed for mid-range, connected motor systems where integration, efficiency, and intelligence drive differentiation.

MG24 consolidates the following all within a single SoC:

  • Real-time BLDC Field-Oriented Control (FOC)
  • Bluetooth Low Energy (LE) connectivity
  • Hardware-based security with Silicon Labs Secure Vault
  • DSP capability and machine learning acceleration
  • Event-driven hardware subsystems such as PRS and LESENSE

This integration enables a unified architecture where motion control, wireless communication, and intelligent processing operate together without competing for system resources.

Deterministic Motion Meets Wireless Responsiveness

Running real-time FOC alongside an active Bluetooth stack traditionally required separate processors to consistently meet tight control loop deadlines. The MG24 demonstrates that this separation is no longer necessary by maintaining precise motor control while sustaining wireless communication and application-level processing.

Designers can build connected motion systems without worrying that protocol activity will disrupt time-critical control loops. This balance is fundamental to next-generation wireless compute architectures for motion.

Intelligence at the Edge

As motion systems become connected, they must also become aware. With integrated DSP capability and the Matrix Vector Processor (MVP) hardware accelerator, MG24 enables local data processing for:

  • Vibration analysis
  • Anomaly detection
  • Predictive maintenance
  • Performance optimization

By processing data at the edge, systems can respond immediately to mechanical changes, reduce cloud bandwidth, and improve overall efficiency. Motor-driven products evolve from executing commands to making informed decisions.

Hardware-Level Event Handling for Efficiency and Stability

The Peripheral Reflex System (PRS) and LESENSE allow hardware-triggered responses to motor and sensor events without CPU intervention. This event-driven design reduces latency, improves stability, and optimizes power consumption. It also frees processing headroom for higher-level functionality, strengthening the overall system architecture.Security as a System Foundation

Connected devices must be trusted over their lifetime. MG24 integrates Secure Vault™ with PSA Level 3 certification, ensuring secure boot, protected key storage, device identity, and encrypted OTA updates. This security foundation enables large-scale deployment of connected motor systems with confidence.Demonstration: Wireless Compute Controlling Motion in Real Time

The architectural shift becomes clear in this demonstration.

In this showcase, a BLDC motor is controlled entirely by a single MG24 device. The SoC executes real-time FOC while maintaining active wireless communication.

During operation, external mechanical interference is introduced. The system detects the anomaly immediately and safely stops the motor. Once normal conditions return, it resumes operation automatically. A connected mobile device provides live interaction and visibility into system behavior throughout the process.

What traditionally required separate controllers for motor control, connectivity, and supervisory logic is consolidated into one integrated wireless compute platform. The demonstration highlights how architectural integration improves responsiveness, safety, and system simplicity simultaneously.

Security as a System Foundation

Connected devices must be trusted over their lifetime. MG24 integrates Secure Vault™ with PSA Level 3 certification, ensuring secure boot, protected key storage, device identity, and encrypted OTA updates. This security foundation enables large-scale deployment of connected motor systems with confidence.

Demonstration: Wireless Compute Controlling Motion in Real Time

The architectural shift becomes clear in this demonstration.

In this showcase, a BLDC motor is controlled entirely by a single MG24 device. The SoC executes real-time FOC while maintaining active wireless communication.

During operation, external mechanical interference is introduced. The system detects the anomaly immediately and safely stops the motor. Once normal conditions return, it resumes operation automatically. A connected mobile device provides live interaction and visibility into system behavior throughout the process.

What traditionally required separate controllers for motor control, connectivity, and supervisory logic is consolidated into one integrated wireless compute platform. The demonstration highlights how architectural integration improves responsiveness, safety, and system simplicity simultaneously.

Enabling the Next Generation of Connected Motion

This approach unlocks new possibilities:

  • Smart shades that detect increased resistance and prevent wear
  • Fluid-handling pumps that identify cavitation and adjust proactively
  • Power tools that monitor vibration signatures for maintenance alerts
  • Actuators that receive firmware updates wirelessly to improve performance

In these applications, differentiation comes from integration and intelligence, not just torque precision.

Where This Architecture Delivers Immediate Value

The impact is strongest in mid-range, high-volume markets where size, efficiency, and connectivity are essential:

Smart Home and Building Automation

Curtains, blinds, vents, compact robotics

Light Industrial and IoT Automation

Actuators, valves, small conveyors

Connected Tools and Appliances

White goods, power tools

Smart Agriculture

Pumps, irrigation systems, feeders

In each category, consolidating motion, connectivity, and intelligent processing into a single device reduces complexity while expanding capability.

A Platform Approach to Motor Systems

The future of motor systems will not be defined solely by faster control loops. It will be defined by integrated platforms. By combining motion control, wireless connectivity, security, and edge intelligence within one architecture, manufacturers can:

  • Accelerate development cycles
  • Simplify hardware design
  • Enable fleet-wide OTA updates
  • Introduce predictive maintenance and service-based business models

MG24 represents this evolution toward wireless compute-driven motion systems.

One Device. Unified Architecture. Scalable Innovation.

Every motor that benefits from connectivity will ultimately require more than a standalone controller. MG24 demonstrates how a single secure, wireless-enabled platform can replace fragmented multi-chip designs and enable smarter, more adaptable products. As connected systems continue to evolve, wireless compute will sit at the center of motion, enabling a new generation of intelligent, integrated devices.

With the release of Aliro 1.0, the Connectivity Standards Alliance (CSA) has taken another step in its mission to unify the smart home, this time by expanding access control across smart locks and ecosystems. Aliro is a standardized credential and communication protocol that enables devices to make access decisions, bringing true tap-to-unlock functionality to consumers. Now, instead of pulling out your phone, opening an app, waiting for it to load, and finding the unlock button, tap-to-unlock works instantly. The experience becomes faster and hassle-free, similar to using a contactless payment card. It also helps device makers accelerate development with a proven, ready-to-build platform designed for secure credentials, flexible connectivity options, and low-power performance.

Durin, Inc. is one of the first device makers to support the new application layer with the recent launch of its Durin Door Manager. The next-generation device works with existing smart locks and features the Silicon Labs MG24 wireless SoC. With the MG24, Durin can validate credentials and protect keys on a single secure wireless platform while the integrated cryptography accelerator keeps performance fast for end users.

Aliro: One Standard for Digital Keys Across Wallets

Beyond making the smart lock user experience smoother, Aliro provides a standardized way to access digital smart wallets across brands. Previously, implementing this required separate processes for Google Wallet, Samsung Wallet, and Apple’s HomeKit/HomeKey, often resulting in added complexity and fees. With Aliro, ecosystem providers can simplify the experience for home users by letting digital keys live directly in the phone’s digital wallet. Users just tap their phones to the reader, with no need to open a separate app or go through multiple steps.

Silicon Labs Accelerates NFC Tap-to-Unlock Access with Integrated Crypto and Wireless Performance

Silicon Labs is helping simplify development by integrating NFC directly into its SDK for Aliro-enabled solutions. This includes a tested and validated NFC transceiver driver, along with hardware-accelerated encryption and secure key management on all Silicon Labs Matter-enabled devices, giving developers confidence and reducing integration effort.

All tap-to-unlock and supporting features, including support for step-up authentication requirements, are included in Silicon Labs’ standard SDK release, making it possible to perform key validation and Access Document verification in a single NFC transaction. Because tap-to-unlock is a core requirement for Aliro certification, this integrated approach gives manufacturers a streamlined, secure path to compliance and a faster time-to-market.

Tap-to-unlock is the baseline requirement for Aliro certification, but our multiprotocol platform also enables true hands-free access, as with the Durin Door Manager.

Aliro is Unlocking New Areas in Access Control

Matter is foundational to hands-free access for commissioning devices, enabling advanced features like digital keys that allow access during specific windows of time. It also makes it so that homeowners don’t have to use different apps from various lock manufacturers. Until now, access control has been fragmented, requiring specific apps supplied by lock manufacturers. To unlock the front door, users are required to open the app that corresponds to the lock. Even in cases where tap-to-unlock is available, launching an app is necessary to gain access. When locks are tied to a single ecosystem, it limits the benefits for users. With Aliro, homeowners can change platforms or ecosystem providers without replacing their lock. And households that include Android users and Apple users can share the same seamless experience. That cross-ecosystem consistency and long-term flexibility are key.

Before Aliro, developers were required to engage every ecosystem provider individually, which included building separate firmware and software integrations as well as paying for access. Now, one implementation can work broadly across devices. This reduces costs for R&D and certification, and cuts time to market.

Bank-Grade Cryptography for Tap-to-Unlock

With Aliro, the security model is very similar to what people already trust for tap-to-pay. When you tap your phone to a lock, you’re using the same class of bank-grade cryptography that includes public and private keys securely stored on the device. As the NFC interaction happens, Aliro runs a rapid sequence of cryptographic checks, which consists of multiple key exchanges happening in just milliseconds. This includes five separate transactions, including verifying the credentials and proving that the device and the lock both hold the correct key pair. Only after that verification does access get granted. Being able to perform these calculations fast is required for a true tap-to-unlock experience. Silicon Labs’ Matter-enabled devices can execute Aliro’s cryptographic exchanges in milliseconds, combining optimized hardware security, low-latency NFC, and efficient wireless stacks to make tap-to-unlock feel instant.

Why Silicon Labs’ Matter Hardware and Aliro Standard Win

Silicon Labs and Aliro are a good pairing because of our leadership position in advancing Matter and purpose-built hardware that accelerates encryption and decryption. This combination enables secure, low-latency authentication and access control without sacrificing power efficiency or user experience. In a market long defined by fragmented, proprietary approaches to mobile credentials and reader communication, Aliro is important. By establishing a common, secure foundation for how user devices and access points interact, the new Aliro standard reduces complexity, increases interoperability, and enables trusted access experiences that scale cleanly across ecosystems, form factors, and deployment models.

The fastest-growing products today are battery-powered, compact, and cost-sensitive, but building them is increasingly complex. Developers are under pressure to move quickly, minimize design risk, and deliver differentiated user experiences, all while working within tight power and size constraints.

This is driving strong adoption of pre-integrated, certified 2.4 GHz wireless modules as a way to reduce development cost, simplify system design, and accelerate time to market. A well-designed module eliminates the need to manage RF layout, component selection, and lengthy certification cycles, allowing teams to focus on real benefits: battery life, application features, sensor performance, and overall product differentiation.

Introducing xGM270S Wireless SiP Modules

Silicon Labs’ xGM270S wireless module family is purpose-built for this reality. These ultra-compact system-in-package (SiP) modules combine a high-performance wireless SoC, large on-chip memory, integrated RF components, and global regulatory certifications into an exceptionally small footprint. Compared to traditional PCB-based modules, xGM270S enables smaller end products, faster development cycles, and lower overall system cost, all without compromising performance or flexibility.

BGM270S: Enabling More Bluetooth LE Applications in a Compact SiP Module

The BGM270S targets a broad set of Bluetooth (LE) end-node applications, including smart home devices, asset tracking and fleet monitoring, access control, industrial automation, sport and wellness products. With a compact 6.5 × 6.5 mm LGA SiP footprint, it’s well suited for space-constrained designs where fast integration and predictable development cycles are critical.

In industrial environments, the BGM270S Bluetooth LE module works well as a controller for sensors such as temperature, pressure, and water flow. For asset tracking tags, it enables reliable connectivity with long battery life, and for portable medical devices, including oximeters and other handheld diagnostic tools, it provides a practical path to connected health monitoring and data collection. In designs with sufficient PCB area to benefit from a fully integrated module, BGM270S SiP module simplifies RF design, reduces development risk, and accelerates time to market.

MGM270S: Speeds Time to Market for Zigbee Green Power Devices

Long battery life is important for IoT end devices, but at scale—such as commercial buildings with thousands of deployed sensors—battery replacement becomes a significant operational cost. This is where the MGM270S stands out with support for Zigbee Green Power and battery-less operation.

With 768 kB of Flash and 64 kB of RAM, the MGM270S Zigbee module provides the memory footprint needed to support Zigbee Green Power while optimizing overall system cost. Its low RX and TX current enables operation from a wider range of ambient energy sources, and the compact SiP form factor makes it ideal for space-constrained devices such as sensors and switches. Combined with global regulatory certifications, MGM270S reduces both development effort and time to market for Zigbee Green Power designs.

xGM270S Wireless SiP Modules: Differentiation That Accelerates Time to Market

Across competing 2.4 GHz module offerings in this class, customers often see similar connectivity features. Where xGM270S stands out is in its combination of an ultra-compact SiP footprint, support for both Bluetooth LE and Zigbee Green Power, and the practical advantage of global certifications and production-ready software. Together, these features reduce development risk and shorten the path from prototype to production.

For customers building smart home devices, patient health monitors, or Zigbee Green Power solutions, the xGM270S value proposition is simple: enable secure, reliable wireless connectivity while keeping system costs low and accelerating time to market—without spending months becoming wireless experts.

Explore the xGM270S wireless SiP module family (BGM270S and MGM270S) to see how quickly you can bring your next connected product to life.

The fastest-growing products today are battery-powered, compact, and cost-sensitive, but building them is increasingly complex. Developers are under pressure to move quickly, minimize design risk, and deliver differentiated user experiences, all while working within tight power and size constraints.

This is driving strong adoption of pre-integrated, certified 2.4 GHz wireless modules as a way to reduce development cost, simplify system design, and accelerate time to market. A well-designed module eliminates the need to manage RF layout, component selection, and lengthy certification cycles, allowing teams to focus on real benefits: battery life, application features, sensor performance, and overall product differentiation.

Introducing xGM270S Wireless SiP Modules

Silicon Labs’ xGM270S wireless module family is purpose-built for this reality. These ultra-compact system-in-package (SiP) modules combine a high-performance wireless SoC, large on-chip memory, integrated RF components, and global regulatory certifications into an exceptionally small footprint. Compared to traditional PCB-based modules, xGM270S enables smaller end products, faster development cycles, and lower overall system cost, all without compromising performance or flexibility.

BGM270S: Enabling More Bluetooth LE Applications in a Compact SiP Module

The BGM270S targets a broad set of Bluetooth (LE) end-node applications, including smart home devices, asset tracking and fleet monitoring, access control, industrial automation, sport and wellness products. With a compact 6.5 × 6.5 mm LGA SiP footprint, it’s well suited for space-constrained designs where fast integration and predictable development cycles are critical.

In industrial environments, the BGM270S Bluetooth LE module works well as a controller for sensors such as temperature, pressure, and water flow. For asset tracking tags, it enables reliable connectivity with long battery life, and for portable medical devices, including oximeters and other handheld diagnostic tools, it provides a practical path to connected health monitoring and data collection. In designs with sufficient PCB area to benefit from a fully integrated module, BGM270S SiP module simplifies RF design, reduces development risk, and accelerates time to market.

MGM270S: Speeds Time to Market for Zigbee Green Power Devices

Long battery life is important for IoT end devices, but at scale—such as commercial buildings with thousands of deployed sensors—battery replacement becomes a significant operational cost. This is where the MGM270S stands out with support for Zigbee Green Power and battery-less operation.

With 768 kB of Flash and 64 kB of RAM, the MGM270S Zigbee module provides the memory footprint needed to support Zigbee Green Power while optimizing overall system cost. Its low RX and TX current enables operation from a wider range of ambient energy sources, and the compact SiP form factor makes it ideal for space-constrained devices such as sensors and switches. Combined with global regulatory certifications, MGM270S reduces both development effort and time to market for Zigbee Green Power designs.

xGM270S Wireless SiP Modules: Differentiation That Accelerates Time to Market

Across competing 2.4 GHz module offerings in this class, customers often see similar connectivity features. Where xGM270S stands out is in its combination of an ultra-compact SiP footprint, support for both Bluetooth LE and Zigbee Green Power, and the practical advantage of global certifications and production-ready software. Together, these features reduce development risk and shorten the path from prototype to production.

For customers building smart home devices, patient health monitors, or Zigbee Green Power solutions, the xGM270S value proposition is simple: enable secure, reliable wireless connectivity while keeping system costs low and accelerating time to market—without spending months becoming wireless experts.

Explore the xGM270S wireless SiP module family (BGM270S and MGM270S) to see how quickly you can bring your next connected product to life.

LAS VEGAS, Jan. 5, 2026 /PRNewswire/ — Silicon Labs (NASDAQ: SLAB), the leading innovator in low-power wireless, is showcasing a comprehensive portfolio of IoT advancements at CES 2026. Through live technical demonstrations, engineering-led presentations and key product introductions, the company is underscoring why developers worldwide rely on Silicon Labs to build secure, scalable, and energy-efficient connected devices.

At CES 2026, Silicon Labs is:

  • Launching the new Simplicity SDK for Zephyr, which brings Silicon Labs QA and support to one of the most popular real-time operating systems (RTOS) for embedded development.
  • Showcasing cutting-edge demonstrations, including Bluetooth Channel Sounding and single-chip wireless motor control using AI/ML.
  • Providing thought leadership across key ecosystem platforms, with Silicon Labs experts speaking and participating in events hosted by the Z-Wave Alliance, Thread Group, and Tuya Smart.
  • Powering partner innovations across the show, with Silicon Labs technology featured in products displayed in booths and meeting suites for AWS, Powercast, Durin, AIZIP, and many others throughout CES 2026.

CES has always been a place for companies to demonstrate how their products are pushing the cutting-edge of innovation. As these devices have become more complex, they require new software that can operate and meet the demands of their advanced applications. To meet that need, Silicon Labs is bringing one of the most popular open-source real-time operating systems to enterprise users.

Silicon Labs Open Source Expertise Extends to Zephyr

On the first day of CES, Silicon Labs announced the release and general availability of the Simplicity SDK for Zephyr. Zephyr has quickly become the go-to open RTOS for connected embedded systems, offering a portable, production-grade alternative to proprietary kernels. As a Platinum member of the Zephyr project, Silicon Labs brings deep open source expertise along with a broad portfolio of wireless protocol technologies, particularly in Bluetooth® LE and Wi‑Fi.

At large-scale IoT deployments — where devices may remain in the field for decades –manufacturers and users need long-term confidence in security, performance, and regulatory compliance. Open-source RTOS options do not always meet these requirements, which is why Silicon Labs is creating an enterprise-grade commercial package for Zephyr.

The new Simplicity SDK for Zephyr delivers:

  • Silicon Labs–maintained distribution of Zephyr: A vetted snapshot of the Zephyr codebase that passes Silicon Labs’ Quality Assurance processes, with additional features and full access to Silicon Labs’ standard support channels.
  • Launch-day wireless coverage: Initial support for Bluetooth LE across popular Silicon Labs SoCs and combined Wi‑Fi + Bluetooth on select devices.
  • Low-friction migration: Existing Zephyr applications can move to Silicon Labs devices with minimal firmware changes, accelerating time-to-market while preserving portability.
  • Faster onboarding: A dedicated Getting Started guide and developer journey reduces setup to a few commands—so teams can build, flash, and debug quickly on Silicon Labs hardware.

For more details on the Simplicity SDK for Zephyr visit “Introducing Simplicity SDK for Zephyr” on the Silicon Labs blog. Developers can begin with the Zephyr Getting Started guide and explore Silicon Labs’ extensive Zephyr resources on GitHub.

Read more about Silicon Labs’ presence at CES, including details on demos and speaking engagements, and see the Top Three Silicon Labs Things to Do at CES on the Silicon Labs blog.

About Silicon Labs

Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power connectivity, building embedded technology that connects devices and improves lives. The company provides highly integrated SoCs, software, and tools for smart home, industrial IoT, and smart city applications, helping device makers create advanced edge connectivity products. Headquartered in Austin, Texas, Silicon Labs operates in more than 16 countries. Learn more at silabs.com.

SOURCE Silicon Labs

Next week, hundreds of thousands of industry innovators will gather for CES 2026—the ultimate proving ground for breakthrough technologies. Devices are getting smarter, but we are excited to see just how visionary that intelligence has become at this year’s show.

Silicon Labs | CES

As the leading innovator in low-power wireless, Silicon Labs empowers these innovations to scale. We bring the breadth, depth, and focus necessary to help device makers build consumer products that are secure, intelligent, and ready for the real world.

We’ll be front and center in the action in our Silicon Labs Suite on the 3rd floor of the Venetian in Toscana 3710, and you can visit us at anytime during exhibition hours or request a meeting to reserve a time.

Silicon Labs Booth at CES

1. Silicon Labs Demos: Power and Precision for IoT Applications

We are featuring two demonstrations that showcase the full capabilities of our xG24 family of SoCs. Designed for the most demanding IoT applications, this platform combines high-performance processing, AI acceleration, and Secure Vault™ technology to handle complex workloads without compromise.

  • Motor Control Breakthrough with the MG24 SoC: Historically, driving a high-speed motor while maintaining a wireless connection required separate devices. We are challenging that architecture with a demo featuring our single MG24 SoC running a full closed-loop BLDC motor control system, controlled via a smartphone app, on a single chip.
  • Bluetooth® Channel Sounding: We are also demonstrating Bluetooth® Channel Sounding on the xG24, showing how this technology equips devices with “true distance awareness” to enable a new tier of secure, proximity-based applications.

See both demos live at the Silicon Labs Suite on Level 3 of the Venetian in Toscana 3710.

 

2. Customer Innovations Breaking the Mold

With thousands of Silicon Labs’ customers around the world, it’s no surprise that some of them would showcase at CES 2026. While there are too many to list, here are three you can’t miss:

  • Intelligent Sensing with Aizip (Booth #9021, LVCC North Hall) In partnership with Aizip, we are demonstrating how Edge AI can outperform traditional sensors by distinguishing between complex acoustic events in real time. Our AI-enabled glass break detection reference design addresses this by using a proprietary deep neural network to listen not just for the initial breaking of glass, but for the secondary impact of shards hitting surrounding surfaces.
  • Multi-factor Access Control with Durin, Inc (Booth #60462, Eureka Park): Check out the brand-new Durin Door Manager. Powered by the Silicon Labs MG24 SoC, this device moves beyond simple smart lock logs to provide true identity verification. By combining multi-factor confirmation with real-time entry snapshots, Durin eliminates the security gap of shared access codes and lets you know exactly who walked through the door, not just when it opened.
  • Battery-Free Sensors with Powercast (Booth #51716, Venetian Expo): Explore how battery-free innovation is redefining efficiency. Powercast is showcasing a battery-free RFID sensor powered by the Silicon Labs BB5 MCU, proving that extreme efficiency can eliminate the need for battery replacements in connected edge devices.

3. Leading the Conversation on Wireless Connectivity for the Smart Home

  • Parks Associates CONNECTIONS Summit at CES (Tuesday, January 6, 9:00 am PT, Lando 4304, Level 4, The Venetian): Colin Cureton, Product Line Manager at Silicon Labs, joins the opening panel of Parks Associates’ CONNECTIONS Summit at CES, “Beyond the Buzz: AI Impact and Revenues in the Smart Home,” to discuss how applications, business models, and revenue streams have been affected by AI.
  • Z-Wave @ CES (Tuesday, January 6, 4:00pm PT, Titian 2205, Level 2, The Venetian): Silicon Labs Senior Field Application Engineer Mark Umina will be participating in a fireside chat in the Z-Wave Alliance ballroom discussing how smart locks can use Z-Wave for user credential verification. He will also be showing how Z-Wave Long Range can complement Amazon Sidewalk to seamlessly communicate across both networks for an interoperable smart home using a single Silicon Labs SoC.
  • Tuya Developer Day (Wednesday, January 7, 3:10 pm PT, LVCC, Central Hall, Booth #16838): Colin Cureton, Product Line Vice President for the Home Business at Silicon Labs, takes the stage with during Tuya Developer Day to discuss how Silicon Labs’ hardware is enabling the next generation of interoperable, AI-ready applications.

 

We can’t wait to see everyone at CES 2026! Stop by our suite, Toscana 3710 on the third floor of the Venetian or request a meeting, and be sure to follow us on LinkedIn, Instagram, and Twitter for live updates from the show