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Ask any Wi-Fi developer what’s the hardest part of their job and you’ll likely hear something along the lines of, “designing an antenna and managing worldwide RF regulatory certifications.” Silicon Labs SiWx917Y ultra-low-power Wi-Fi 6 modules address this with an integrated antenna and worldwide RF-certifications, removing the biggest development headache and saving development time and costs. To lower the bar for exploring the benefits of SiWx917Y Wi-Fi 6 modules, we are excited to introduce a new, simplified Wi-Fi development kit, SiWG917Y Module Wi-Fi 6 and Bluetooth LE Explorer Kit.Wi-Fi Development Kit Overview

SiW917Y-EK2708A - SiWG917Y Module Wi-Fi 6 and Bluetooth LE Explorer Kit

The SiWx917Y Module Explorer Kit is a small form factor development and evaluation platform based on the SiWG917Y module. The Explorer Kit is designed for rapid prototyping and concept creation of IoT applications for Wi-Fi 6, Bluetooth LE, and Matter over Wi-Fi wireless protocols.

The Explorer Kit comes flashed with the Wi-Fi out-of-box demo image. Together with our WiSeConnect SDK SoC Getting Started Guide and Wi-Fi Developer Journey, getting started with your ultra-low-power Wi-Fi module development cannot get any easier than the Explorer Kit.Key Features of the Wi-Fi Development Kit

Below is a snapshot of the main features of the SiWx917Y Module Explorer Kit, and full details can be fond on our official SiWx917Y Module Explorer Kit product page.

  • On-module 8 MB Flash with 8 MB external PSRAM
  • LEDs, user push buttons, ISP boot button, reset button
  • On-board SEGGER J-Link debugger: SWD, VCOM
  • USB Port: Board Power, Serial Communication (ISP Bootloader)
  • Breakout pads for GPIO access and connection to external hardware
  • MikroBUS™ socket and Qwiic® connector interfaces

Silicon Labs SiWx917Y Wi-Fi 6 Module Overview

The SiWx917 wireless MCU is a product family of ultra-low-power, high-performance System-on-Chip (SoC) and RF-certified modules for secure multiprotocol Wi-Fi 6, Bluetooth Low Energy 5.4, Matter, and IP networking with full-fledged application computing and AI/ML for always-on cloud-connected IoT devices.

The SiWx917Y module integrates the SiWx917M SoC, RF shielding, antenna or RF-pin, 40MHz crystal, and worldwide RF-certifications in a PCB module package with dimensions of 16 x 21 x 2.3 mm. Multiple orderable part numbers (OPN) are available with different antenna, RF-pin, PSRAM, Flash, and operational mode configurations.

The SiWx917Y modules support RF regulatory certifications in several regions worldwide including modular radio type approvals for countries such as the USA (FCC), Canada (IC/ISED), MIC (Japan), and relevant EN standards (including EN 300 328 v2.2.2) for conformity with the directives and regulations in the EU (CE) and UK (UKCA) (Contact Silicon Labs for the latest certification status).

How to Get the New Wi-Fi Development Kit

If you are ready to start exploring the wonders of ultra-low-power Wi-Fi 6 modules, you can go to our product page and order the SiWx917Y Module Explorer Kit through our retails partner websites.

More Wi-Fi Development Kits

Should you want to learn about our other Wi-Fi development kits and boards, please read our blog on how to choose the right Wi-Fi development board.

SiXG301 and SiXG302, Silicon Labs’ first wireless SoC families at the 22 nm process node, deliver breakthroughs in compute, power efficiency, integration and security

AUSTIN, Texas, May 22, 2025 /PRNewswire/ — Silicon Labs, the leading innovator in low-power wireless solutions, today announced the first products of its Series 3 portfolio with the introduction of two new wireless SoC families built at the advanced 22 nanometer (nm) process node: the SiXG301 and SiXG302. These highly integrated solutions represent a significant leap forward in compute power, integration, security, and energy efficiency, addressing the growing demands of both line-powered and battery-powered IoT devices.

As smart devices grow more sophisticated and compact, the need for powerful, secure, and highly integrated wireless solutions has never been greater. The new Series 3 SoCs deliver on this promise with advanced processing capabilities, flexible memory options, best-in-class security, and streamlined external component integration. Silicon Labs’ Series 1, Series 2, and Series 3 platforms will continue to complement one another in the market and address the full breadth of IoT applications.

The new Series 3 families of SoCs include:

  • SiXG301: Optimized for Line-Powered Applications
    Purpose-built for line-powered smart devices, the SiXG301 includes an integrated LED pre-driver and offers an ideal solution for advanced LED smart lighting and smart home products, supporting Bluetooth, Zigbee, and Thread with support for Matter. Built with high Flash and RAM overhead of 4 MB and 512 kB, respectively, the SiXG301 helps future-proof customer designs as the requirements for Matter and other more demanding IoT applications continue to grow. This SoC enables concurrent multi-protocol operation for Zigbee, Bluetooth and Matter over Thread networks at the same time, which helps simplify manufacturing SKUs, reduce costs, save board space for additional device integrations, and improve consumer usability. Already in production with select customers, the SiXG301 is slated for general availability in Q3 2025.
  • SiXG302: Designed for Battery-Powered Efficiency
    Expanding Series 3 to battery-powered applications, the upcoming SiXG302 will deliver groundbreaking energy efficiency without sacrificing performance. Featuring Silicon Labs’ advanced power architecture, the SiXG302 is designed to use only 15 µA/MHz active current, 30% lower than competitive devices in its class. This makes it ideal for battery-powered wireless sensors and actuators for both Matter and Bluetooth applications. The SiXG302 is planned for customer sampling in 2026.

“Smart devices are becoming more complex, and designers are challenged to pack greater functionality into smaller spaces while maintaining energy efficiency,” said Ross Sabolcik, Senior Vice President of Product Lines at Silicon Labs. “With the SiXG301 and upcoming SiXG302 families, we’re delivering flexible, highly integrated solutions that enable next-generation IoT devices—whether they’re plugged in or running on battery power.”

The SiXG301 and SiXG302 families will initially include “M” devices for multiprotocol, the SiMG301 and SiMG302, and “B” devices optimized for Bluetooth LE communications, the SiBG301 and SiBG302.

By leveraging the 22 nm process node for all Series 3 devices, Silicon Labs is addressing the growing demand for more powerful and efficient far-edge devices across a wide range of IoT applications—from smart cities and industrial automation to healthcare, smart homes, and beyond. These new SoCs offer device makers a scalable, secure platform to create the next wave of innovative, high-performance IoT products.

Learn More About the Series 3 Platform at Works With 2025

To learn more about the Series 3 platform and how it is advancing wireless connectivity, visit:

Additionally, Silicon Labs will highlight the SiXG301 along with its portfolio of industry-leading innovations during the 2025 Works With conference series. This global event brings together industry experts to explore the best practices, emerging technologies, and transformative trends shaping the industry. The conference will be hosted across multiple international locations, with a virtual edition available for broader accessibility:

  • Works With Summit: October 1-2 in Austin, TX
  • Works With Shenzhen: October 23
  • Works With Bangalore: October 30
  • Works With Virtual: November 19-20

Learn more about Works With today.

About Silicon Labs Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power wireless connectivity, building embedded technology that connects devices and improves lives. Merging cutting-edge technology into the world’s most highly integrated SoCs, Silicon Labs provides device makers with the solutions, support, and ecosystems needed to create advanced edge connectivity applications. Headquartered in Austin, Texas, Silicon Labs has operations in over 16 countries and is the trusted partner for innovative solutions in the smart home, industrial IoT, and smart cities markets. Learn more at www.silabs.com.

SOURCE Silicon Labs

The total number of IoT devices is expected to reach 30-40 billion units globally by 2030. Historically, the IoT has been dominated by low-power wireless technologies including Zigbee, Thread, and Bluetooth Low Energy (LE). These are light-weight protocols that offer the level of energy-efficiency required by small, resource-constrained, and battery-operated IoT devices.

However, the rapid evolution of Wi-Fi 6, the most energy-efficient generation of the protocol, is quickly closing the power-consumption gap with the traditional low-power IoT protocols and becoming a viable option for the IoT. Silicon Labs’ SiWx917 ultra-low-power Wi-Fi 6 wireless MCU has been tested to enable multi-year battery life on IoT devices, further proving the case for Wi-Fi’s growth in the IoT space. However, IoT is more than just low power consumption. This blog explains the typical characteristics of the IoT-optimized Wi-Fi and how device makers can optimize Wi-Fi for their IoT devices.

Requirements for Modern Wi-Fi IoT Devices

For IoT device makers, power consumption has been the most complicated design challenge in Wi-Fi. Modern IoT devices and smart appliances are tasked to run increasingly sophisticated applications in smart homes, building automation, hospitals, enterprises, and industrial environments. They’re collecting data from many types of sensors, executing advanced computation locally, connecting to the cloud over multiple protocols, and communicating fluently with various ecosystems. IoT devices need to run advanced security algorithms to keep users safe while also inferencing vast amounts of data through machine learning algorithms (ML) to detect patterns and anomalies. During their multi-year operational lifetime, IoT devices also require ample memory capacity to accommodate frequent software and security over-the-air (OTA) updates.

Consequently, when designing Wi-Fi IoT devices, manufacturers need to recalibrate their perspective on optimizing Wi-Fi for IoT. It’s not only about minimizing power consumption, but also about implementing all the advanced capabilities such as compute, memory, security, AI/ML, ecosystems, and peripherals on compact form-factors and scarce resources of IoT devices while adhering to tight energy regulations.

SiWx917 is the Most Optimized IoT Wi-Fi Connectivity Solution

Silicon Labs’ SiWx917 was built for IoT from the ground up. It’s the most IoT-optimized Wi-Fi solution in the market, comprising a comprehensive ultra-low-power wireless MCU with all the crucial elements of IoT within a footprint of 7×7 mm.

 

Iot wifi poster

Ultra-Low-Power for Cloud Connected Sleep Mode

Wi-Fi IoT devices such as smart locks, switches, security cameras, and sensors spend most of their time in a connected sleep mode – i.e., sleeping while being associated to the Wi-Fi access point (AP) and connected to the cloud. The periods of active communication typically last just seconds after which the device resorts back to the connected sleep mode. Due to the very “sleepy” IoT duty-cycle, the connected sleep is the most critical factor affecting device’s power consumption and battery life.

SiWx917 features the lowest Wi-Fi 6 power consumption for cloud-connected sleep mode in its class, only 22µA. Its combined system power consumption for Wi-Fi 6 connected sleep mode with the application MCU in sleep is just 37µA.

The sheer power-efficiency of the SiWx917 solves the main design challenge for device makers: long battery life and low standby current consumption. In fact, an independent testing provider, Novus Labs, estimated that SiWx917 can enable smart locks to reach a 5-year battery life with four AA batteries with a capacity of 3000mAh.

 

Wi-Fi IoT Frequency Band

The home is a challenging RF-environment for Wi-Fi product developers due to reflecting surfaces and signal attenuating obstacles such as concrete walls. SiWx917 uses the IoT-friendly 2.4 GHz frequency band to deliver energy-efficient, long-range indoor Wi-Fi 6 connectivity with effective wall penetration and high bandwidth.

 

Dual-Processor Architecture

The dual-core processor architecture with a powerful application MCU and network wireless processor (NWP) always maximizes performance and efficiency in both sides. The NWP also runs the IP-networking stack and security engine offloading these tasks from the application MCU, and allowing it to sleep while the NWP handles all network protocol traffic and collects sensor data.

 

Edge Computing

The SiWx917 is a fully-integrated edge computing platform including an application MCU, large memory, a rich set of peripherals, ADC, Sensor Hub, DCDC converter, high GPIO count, security engine, an AI/ML accelerator, and much more, allowing manufacturers to squeeze every last drop of efficiency out of its compact 7x7mm footprint.

 

Ultra-Low-Power Peripherals

The ultra-low-power (ULP) peripherals are a crucial element of the low-power capabilities of SiWx917. They enable sensor data collection while the application MCU and NWP are sleeping, saving considerable amounts of energy.

 

Large Memory

Wi-Fi IoT devices and smart appliances need to run ever more advanced applications and endure years of operational lifetime on the field. During this time, they will receive frequent software and security updates. The SiWx917 features the largest SRAM, PSRAM, and Flash memory configuration in its category, giving device makers more space for the application, OTA updates, wireless stacks, Matter, and future code growth.

 

Matter Protocol Support

The Matter protocol is the de-facto application layer technology aggregating the most popular smart home ecosystems such as Amazon, Apple, Google, and Samsung under a single umbrella. The SiWx917 offers a single-chip Matter support and pre-certified Bluetooth LE for fast integration to popular ecosystems, significantly reducing development and testing work for the device makers.

 

RF-Certified Modules

Competition in the Wi-Fi IoT market is intense, yet Wi-Fi involves a complicated and time-consuming certification and testing, impacting time to revenue. To speed up Wi-Fi antenna design and RF certifications, SiWx917Y modules integrate antenna (or RF-pin), 40MHz crystal, and worldwide RF-certifications in a 16x21mm PCB package, reducing development and BoM sourcing costs and accelerating development time radically.

 

Learn More About IoT-Optimized Wi-Fi

Silicon Labs provides you with the most IoT-optimized Wi-Fi solutions, integrating all the capabilities of modern IoT into a single package while maximizing battery life and minimizing standby current for smart devices. Click below to learn more about our IoT-optimized Wi-Fi solutions and get a low-power Wi-Fi whitepaper and power optimization examples for six IoT devices.

Unify SDK: A Major Step Forward in Z-Wave IoT Gateway Development

The latest Unify Software Development Kit (SDK) release introduces updates designed to bring significant enhancements to Z-Wave support, security, and protocol functionality. This release marks a shift as Unify now focuses solely on Z-Wave, removing support for Zigbee and Bluetooth protocol controllers. Key updates include expanded Z-Wave command class support, the introduction of Z-Wave S2V2 Alpha, and a refined scope for the Matter Bridge. These changes ensure a more streamlined, secure, and efficient development experience.

Key Updates in This Unify SDK Release

Expanded Z-Wave Command Class Support

Z-Wave command classes define the functionalities and capabilities of Z-Wave devices. To improve interoperability, we have added commonly used Z-Wave command classes for this release. This ensures that the core functionalities remain intact while simplifying development and certification.

A fully updated Z-Wave command class list is available, providing developers with a clear reference for supported features. Customers can add their own implementation of command classes if they are not found in the existing tool through the contributor license agreement (CLA).

Splitting of Repository: Sustainability and Modulatory

The latest release has significantly enhanced the user experience by refactoring and splitting the repository into three distinct repositories. Previously, all components were housed in a monorepository, or monorepo, which led to complicated dependencies and code management challenges. By dividing the repository into three separate repos, the codebase is now more accessible and easier for developers to understand and implement. This strategic move aims to simplify the development process, making it more efficient and developer friendly.

Introduction of Z-Wave S2V2 Alpha

Security is a major focus of this release, and we are excited to introduce Z-Wave S2V2 (Security Version 2) Alpha. This update strengthens encryption and authentication mechanisms for enhanced device protection.

The alpha version of S2V2 has already been supported on Z-Wave end devices.

The Unify SDK now integrates S2V2 support on the gateway side, ensuring end-to-end security between the controller and end devices. This enhancement strengthens encryption and authentication mechanisms, providing a more secure development environment. It’s important to note that the S2V2 security implementation is currently in its alpha stage on the Unify side, indicating that while the foundational security features are in place, further refinements and optimizations are expected in future updates.

Matter Bridge: Scope Adjustment

The Matter Bridge is a component that facilitates communication between Matter and non-Matter devices (in this case, Z-Wave devices). In this release, we are redefining the Matter Bridge as an example code. Example code provides developers with a functional starting point to speed their development. They can update and modify the code as needed for their specific implementation. The example code provided is designed to be a starting point for developer and is not maintained by Silicon Labs.

Need More Help? Get expert support and custom solutions at Silicon Labs Developer Services.

Unify SDK is Now Dedicated to Z-Wave Development

With these updates, Unify SDK marks a significant shift, dedicating itself solely to the Z-Wave protocol. By having a single focus, we are making Unify SDK more robust and streamlined for developers. Customers who are currently using Z/IP Gateway can now transition to the Unify Z-Wave Protocol Controller, ensuring continued support and updates. By enhancing Z-Wave command class support, improving security with S2V2, and refining the role of Matter Bridge, this release ensures:

✔ Better interoperability and feature parity with past gateway designs

✔ Stronger security and encryption for connected devices

At Silicon Labs, we are dedicated to advancing the Wi-SUN standard and ensuring that our solutions meet the highest industry standards. Silicon Labs has been at the forefront of developing Wi-SUN solutions for over a decade, and this continues with the certification of our EFR32FG25 for FAN 1.1 router and border router applications. Our focus on Wi-SUN FAN 1.1 certification is a testament to our commitment to providing reliable, efficient, and future-proof connectivity solutions, exemplified by being one of the first 3 companies in the world to achieve this certification. Our extensive experience and expertise have enabled us to create a comprehensive portfolio that supports both OFDM and FSK technologies. Our Wi-SUN certified ICs, reference designs, and development tools are designed to simplify the certification process and accelerate time-to-market for our customers.

Wi-SUN FAN 1.1 Certified Devices

Our EFR32FG25 and EFR32FG28 devices are specifically designed to support the Wi-SUN FAN 1.1 standard. These devices offer high data rates, with the EFR32FG25 supporting up to 3.6 Mbps. By providing robust support for both FSK and OFDM PHYs, these devices ensure that your products meet the stringent requirements of the Wi-SUN Alliance. The inclusion of Silicon Labs devices as part of the Certified Test Bed Units (CTBU) ensures your devices meet the highest standards of the Wi-SUN Alliance. This certification underscores our commitment to quality and performance, providing you with confidence that your solutions are reliable and secure.

Our certified reference designs are a key component of our Wi-SUN FAN 1.1 support. These designs simplify the development process, reduce complexity, and ensure compatibility with Wi-SUN standards. By using our certified reference designs, you can accelerate your development timeline and bring your products to market faster. Our Wi-SUN FAN 1.1 support provides reliable and efficient communication, ensuring your devices stay connected in even the most challenging environments. With our certified Wi-SUN stack, you can trust that your solutions will meet industry standards and deliver consistent performance. Backwards compatibility with FAN 1.0 ensures that your investment is protected, and your network can evolve with emerging technologies. Our comprehensive development tools streamline the design process, reducing time-to-market and development costs.

Silicon Labs’ Wi-SUN FAN 1.1 Support

As a Wi-SUN Alliance Promoter Member, Silicon Labs is dedicated to advancing the Wi-SUN standard and delivering cutting-edge solutions that meet the needs of our customers. Our ongoing participation in the development of future specifications ensures that you always have access to the latest advancements in wireless technology. Experience the future of connectivity with Silicon Labs’ Wi-SUN FAN 1.1 support, where innovation meets reliability and performance. In the ever-evolving landscape of wireless communication, the Wi-SUN standard stands out as a beacon of innovation. Designed to facilitate seamless connectivity among smart-grid devices, Wi-SUN is tailored for large-scale outdoor IoT networks. These networks encompass a wide array of applications, including Advanced Metering Infrastructure (AMI), smart cities, asset management, environmental monitoring, agriculture, structural health monitoring, home energy management, distribution automation, and much more.

Wi-SUN FAN 1.1 Certification Ensures Interoperable Devices

The Wi-SUN Alliance is a global non-profit member-based association made up of industry-leading companies like Cisco, Silicon Labs, Landis + Gyr, and Itron, Its goal is to drive the global proliferation of interoperable wireless solutions for use in smart cities, smart utilities, and other Internet of Things (IoT) applications using open standards. The Wi-SUN Alliance has developed the FAN certification program to certify devices. Through FAN certification, the Wi-SUN Alliance certifies products based on their compliance with a communications profile derived from open standards and their ability to interoperate with other Wi-SUN certified products.

As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex. Engineers often face the dilemma of choosing between ICs and wireless modules for their IoT applications. Both options offer unique benefits and trade-offs, impacting factors such as design complexity, cost, scalability, and time to market. This blog explores the technical considerations and challenges associated with each, drawing insights from Silicon Labs’ expertise in wireless solutions. We’ll provide a technical comparison between ICs and modules, highlighting the key differences, benefits, and hidden costs associated with each approach.

Understanding ICs and Modules

An IC (SoC) is a semiconductor device that contains a processor, memory, and other functional elements on a single chip. Engineers designing with ICs must develop a supporting PCB, including antenna design, RF matching, power management, and other components.

A module, on the other hand, is a pre-integrated system that includes an IC along with all necessary supporting components, such as RF-pin/built-in antenna, EMC shielding, power supply filtering, RF matching components, antenna components, and worldwide regulatory certifications. Modules are designed to minimize the hardware environment required to implement a complete solution, reducing design complexity and certification efforts.

Design and Development Considerations for ICs and Modules

RF Design Complexity

  • IC: RF engineers must meticulously design and optimize antenna layouts, PCB trace lengths, and matching networks. Even slight variations in layout can degrade signal performance, requiring extensive debugging.
  • Module: Pre-optimized RF design eliminates the need for complex antenna placement and matching, reducing development time and effort.

Certification and Compliance

  • IC: Products using SoCs require separate regulatory approvals for each target market (FCC, CE, etc.), which can be costly and time-consuming.
  • Module: Modules come with pre-certified regulatory approvals, significantly reducing certification costs and risks.

Time to Market

  • IC: The complexity of RF design and certification can delay product launches by 3-6 months.
  • Module: Faster development cycles enable quicker market entry, a crucial advantage for competitive industries.

Cost Analysis

  • IC: Lower initial component costs, but higher design and certification expenses. Suitable for large-scale production where economies of scale justify the investment.
  • Module: Higher per-unit costs, but reduced design and development expenses. Ideal for low to medium production volumes.

Hidden Costs of IC Design

As highlighted in the Silicon Labs whitepaper, “Six Hidden Costs in a Wireless SoC Design,” designing with SoCs introduces hidden costs that are often overlooked:

  • RF Expertise: Hiring specialized RF engineers can cost $100,000 to $200,000 annually.
  • Lab Equipment: Spectrum analyzers, anechoic chambers, and other RF test equipment can cost up to $50,000.
  • PCB Layout: Achieving optimal antenna performance requires iterative PCB design and manufacturing cycles.
  • Certification Costs: Regulatory testing for SoCs can exceed $50,000 over a five-year period.

SiP (System-in-Package) vs PCB Modules

When considering ICs and modules, another factor is the form factor used.

SiP Modules

System-in-Package (SiP) modules integrate multiple components into a single package, offering a compact solution with optimized RF performance with smaller size (<12mm x 12mm), pre-integrated components, advanced packaging techniques (e.g., stacked memory), optimized for high-performance applications and requires careful thermal and mechanical design.

PCB Modules

PCB modules consist of a carrier board with components mounted separately. They offer easier development and in-house prototyping, more flexible design changes, easier second sourcing, and generally larger size (>10mm x 10mm).

SiP Modules for Miniaturized IoT Designs

Silicon Labs’ System-in-Package (SiP) modules, such as the BGM220S, exemplify the benefits of module-based design. These modules feature integrated RF components and shielding, offering superior size and performance optimization for space-constrained applications like wearables and smart sensors. With a compact 6.5 mm x 6.5 mm footprint, SiP modules reduce PCB real estate while ensuring robust RF performance.

When to Choose IC vs Module

ICs are ideal when:

  • High production volumes justify the upfront design and certification costs.
  • The design team has access to RF expertise and advanced lab facilities.
  • Custom RF optimization is critical for the application.

Modules are preferable when:

  • Rapid time to market is essential.
  • Regulatory certification costs need to be minimized.
  • The application requires a compact and standardized design.

A Balanced Approach

The decision between IC and module depends on specific project requirements, resources, and business goals. Silicon Labs’ ability to provide both solutions ensures that customers can seamlessly transition from modules to SoCs as their production volumes and design capabilities evolve. By partnering with a single supplier, companies can protect their software investment and optimize their IoT designs for long-term success.

Silicon Labs, a leader in IoT connectivity, has consistently set new benchmarks in MCU performance, capabilities, and applications. Today, we’re announcing the general availability of the PG26 – a general-purpose microcontroller with a large combination of flash and RAM that features a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds. This addition to our portfolio is equipped to address a wide array of challenging applications, making it an essential tool for AI/ML-driven applications.

 

A 32-bit Microcontroller Specifically Designed for Energy-Efficient Embedded Development

The PG26 offers an impressive 3200 kB of flash and 512 kB of RAM, both of which lead Silicon Labs’ Series 2 platform. This combination allows for more complex AI/ML models, larger customer applications, and bigger ML models for more accuracy. It also offers a rich peripheral set with a substantial number of GPIOs which enables better system integration. Its 64 GPIOs and four additional analog-only pins reduce the need for external components, which is also facilitated by an integrated LCD driver that can support up to 288 segments. The high performance, multicore compute platform (80MHz Cortex-M33 Core) is also equipped with Secure Vault™ High to improve efficiency and security. Like other Series 2 MCUs, the PG26 is firmware-compatible across the portfolio, making it easier for developers to work across multiple devices. The PG26 maintains the low-power performance Silicon Labs developers are used to, making it an ideal main microcontroller for sensors and home automation devices.

 

The PG26 MCU Brings Advanced AI/ML Functionality, More Memory, and Additional GPIO

The PG26 provides developers with a wide variety of options to meet diverse application needs. Its low power consumption and small form factor are ideal for energy-sensitive applications. Its precision analog capabilities and integrated LCD are ideal for applications requiring accurate measurements and display functionalities while maintaining low-power performance. The PG26, with its enhanced AI/ML capabilities, more memory, and additional GPIO, is designed for advanced applications that require high processing power and flexibility. Lastly, the latest PG26 offers the most memory, a comprehensive peripheral set, and extensive GPIO options, making it well-suited for complex and memory-intensive applications like industrial automation, predictive maintenance, and monitoring.

 

The PG26 Microcontroller Makes it Easy to Transition to Embedded IoT Designs

The xG26 platform (BG26, PG26 and the most recently announced MG26) supports a dual strategy, allowing developers to choose between connected and non-connected configurations based on their specific needs. This flexibility ensures that the xG26 can be used in a wide range of applications, from standalone devices to complex IoT systems. One of the key advantages of the xG26 platform is its firmware compatibility and common toolchain across the entire Series 2 portfolio. This ensures that developers can migrate their applications quickly and easily to take advantage of the latest features and improvements without extensive rework. The xG26 platform also offers footprint compatibility, making it easier for developers to upgrade their designs and integrate new features without significant changes to the hardware layout.

Silicon Labs has a rich history of developing cutting-edge microcontrollers, consistently pushing the boundaries of innovation and reliability. The PG26 builds on decades of expertise and technological advancements, bringing Silicon Labs’ track record of integrating advanced connectivity features to enable seamless communication with various devices and networks. This combination of robust performance, advanced security, and wireless capabilities makes the xG26 a standout choice for modern applications.

We recently had a Matter roundtable at Silicon Labs Works With 2024. It was a fantastic chance for ecosystems, device makers, development partners, and others to learn more about the current state of Matter, its challenges and limitations, what is being done to address its shortcomings, new device types coming in the future, and new markets or use cases that are being worked on.

The goal of the roundtable was to allow people to have a more open and honest conversation, so we did not stream or record the event as has been done in previous Works With events. This allowed for attendees to share their own experiences for bad or good, confusion with the goals of the standard, or just general concerns. It is never easy to hear this but is important to get the open feedback.

One of the pieces of confusion that we heard had to do with the need for multiple apps on your mobile device. Shouldn’t Matter mean I can get rid of all my other smart home apps? I never need to even download another smart home app again right? Well, almost.

Matter as a standard has done great things for providing a baseline of interoperability to greatly simplify the commissioning and standardize IP based IoT communications. This helps so many new and existing device makers avoid inventing ways of doing the same basic commissioning that Matter already provides. It doesn’t mean there isn’t room for improvement in the Matter device setup, but the goal is to ensure that proprietary improvements will be really innovative and not just mildly improved.

When it comes to smart home apps, I see them falling into three categories:

  • Generalist smart home apps
  • Device feature apps
  • Services apps

Generalist Smart Home Apps

There is a lot of simple functionality that can be accessed via Matter, and that means users can do most all of it with just a single app. Matter already has support for most of the popular device types. Put more succinctly, I don’t need multiple lighting apps on my phone just because the smart bulbs happen to be from different manufacturers.

Apps that will handle most of the basic home automation, I call generalist smart home apps. These will handle associating devices with different rooms, scenes, routines, and labelling them to make logical sense with the way we naturally live in our smart homes. Users only need one of these generalist apps on their phone. However, it’s important that we allow users the option to switch between generalist smart home apps if they want. One of the goals of Matter is to avoid manufacturer lock-in by ensuring devices can be paired to multiple smart home apps simultaneously, even if the user will only use one.

From a developer perspective, creating your own mobile app is a high barrier to entry and could mean a sub-par experience for something basic. I recently bought a temperature sensor system that had a hub and a number of remote sensors so that I could monitor the temperature in remote locations in my house (the garage, the attic, and a couple of rooms where the thermostat wasn’t located). My goal was to get a better sense of the temperature swings during the cold winters and the warm summers here in the Boston area. These temperature sensors required me to download the mobile app, create an account on the manufacturer’s website, commission the hub, commission each sensor individually, label the sensors, and only then could I finally achieve what I wanted. Monitoring the system required me to re-launch the app regularly, which on occasion made me log back in just to see the temperature. The worst part is that this particular system had extremely poor range and I couldn’t find the right place to install the hub to make all the sensors happy. I eventually gave up and returned the system.

This entire experience has a lot of overhead just to get a temperature sensor up and running. This really shouldn’t be the case, for either a user or developer. It is easy to say that a temperature sensor doesn’t need its own Mobile App. This is an obvious case where a generalist smart home app could easily provide support for temperature sensors along with its other features and functionality. Apple, Google, Samsung, and Amazon all provide this kind of experience through their current hardware and software offering.

Smart Home Device Feature Apps

But now let’s take something more sophisticated like a robot vacuum. This is a more complex device type that can be setup with a schedule, maps of rooms, excluded vacuum areas, control for mopping vs vacuuming, sensors for indicating battery charge, the level of the vacuum bag, and more. Although Matter does have support for robot vacuums, you can easily see why you may want to have a device feature app on your phone for your a robot vacuum and its more complex management. Now certain simpler functionality could be handled, and I would argue should be handled, via a generalist smart home app means. Start, stop, or notifications could easily be handled by a generalist app. If your robot vacuum starts running while you are in the middle of having a kids party, you may want to very quickly use a voice assistant to tell the device to stop or delay its routine. Perhaps the device gets stuck, and you would like to see a notification pop up on a more convenient screen such as a Matter-enabled TV.

From a user perspective, it should be intuitive when you need a dedicated app.

From a developer perspective, Matter enables simpler device integrations but also provides flexibility for a more complex interface experience via a dedicated device feature app. Building a smart home mobile app is now a choice based on the user experience and the device capabilities, rather than just a necessity in all cases.

For some device classes, Matter will grow in its feature set and the major ecosystem will evolve to provide a “good enough” experience for your device that you can phase out your own specialized app. For smaller companies, this means they can focus on adding new hardware features rather than being required to hire mobile developers to re-create yet another a smart home mobile app.

Smart Home Device Services Apps

Now, for a users there will be situations where a generalist smart home app will be too simple in what it can do but where a device feature app will be too limiting. A device feature app is focused in its usage to interact with a single device or single device type. What a user may want is to integrate with a feature across multiple devices. This is where a services app comes in.

Take for example the case of energy management. Matter has enabled devices to report their energy usage and provide the means to aggregate that data in a single unified place. A services app can interact with multiple devices in the home all in support of tracking energy usage. An energy management app needs to understand big energy consumers, like thermostats connected to HVAC, laundry dryers, laundry washers, and a few other related devices like ceiling fans. It doesn’t need to know about lights or sensors or many other Matter enabled nodes that are just not relevant to that goal. It doesn’t need to provide home automation routines or integrate with a voice assistant. This app may have knowledge of your local utility’s cost for electricity or that you have solar panels on your roof, or a generator hooked up to the house. An energy management app may have dedicated screens showing your energy usage over time, correlating this to the past weather conditions. It could have various modes focused on how you can fine tune energy in your home or business to achieve lower costs or just going more green and comparing to your neighbor’s usage. This kind of app will need access to your Matter network but is not meant to be a substitute for the other kinds of apps, and in particular will not be a generalist app.

This kind of specialized service offering is common on the internet. Take for example Slack. Slack is still hugely important for business messaging. It integrates with a number of other tools to provide a means of getting updates and even interacting all within Slack as a means to provide a better user experience. However, it is not a substitute for those other tools. You can integrate Slack with Jira to get updates and perform some simple operations, but it doesn’t replace Jira. I foresee the same kind of thing will occur with user’s Smart Homes.

Smart Home App Conclusion

Ultimately it’s up to the user to decide how they want to manage their network. If they want only a single generalist smart home apps because their usage is simple enough that’s their choice. But if they need a bit more functionality there is option for a blend of smart home apps based on what they do or which one the user likes best.

Having the option for multiple apps is a good thing because it will allow companies to specialize and innovate, and of course compete. Device makers can focus on building the best-in-class device and how to highlight those unique elements that users desire. Services apps can build a service offering based around a theme or specialized use case without having to support all the Matter enabled device types. For all the typical automation use cases, you have the generalist apps.

To put it more succinctly, Chris La Pre Head of Technology at CSA had this great way to summarize it: “You’ll intuitively know when you need a separate app for your smart home device”.

As wireless communications continue to evolve, the demand for devices that can support multiple protocols simultaneously has grown significantly. This capability, known as concurrent multiprotocol (CMP), allows devices to operate across different wireless standards at the same time, increasing their versatility and adaptability. CMP is a benefit because while devices can traditionally handle multiple protocols, this often requires incorporating multiple radio ICs. CMP simplifies this by enabling devices to achieve the same functionality with just a single radio IC, making it more cost-effective for developers. In this blog, we will dive into the concept of CMP and examine the distinctions between CMP – single channel, CMP with concurrent listening, and CMP with Bluetooth Low Energy (LE) Dynamic Multiprotocol (DMP).

 

Concurrent Multiprotocol CMP: Single Channel

CMP allows a device to support multiple wireless protocols simultaneously that are based on the same IEEE 802.15.4 standard, such as Zigbee and Thread.

By sharing the 802.15.4 PHY and MAC layers, and with Zigbee and Thread operating on the same channel, this feature enables the device to concurrently receive Zigbee or Thread packets using a single radio (and no time slicing). It achieves the differentiation between the protocols through the unique PANID associated with each protocol stack, a functionality referred to as the Multi-PAN feature.

The key advantage of CMP lies in its simplicity and ability to operate on multiple networks with no decrease in performance other than medium congestion.

Concurrent multiprotocol cmp single current
  • Ability to support multiple IEEE 802.15.4 protocols such as Zigbee and Thread operating on the same channel
  • True concurrency (no time slicing)
  • Rx frames differentiated by PAN IDs
  • Channel access managed by normal 802.15.4 CSMA-CA
  • Functional in SoC, (selective) NCP and RCP modes

 

Concurrent Multiprotocol with Concurrent Listening

Concurrent multiprotocol with concurrent listening takes the concept a step further by allowing the device to support multiple wireless protocols operating on independent channels simultaneously.

With the radio rapidly switching between the two operating channels (in the order of tens of microseconds) to detect incoming packets, CMP with concurrent listening allows the device to concurrently listen for Zigbee and/or Thread packets on their respective channels using a single radio and no blocking window.

This is particularly useful in scenarios where a single device needs to be a part of two separate mesh networks operating on different channels. For example, with concurrent listening, a central hub in a smart home environment, that is part of multiple mesh networks can simultaneously monitor signals from various sensors, ensuring timely and precise responses to events such as motion detection or temperature changes. Another key advantage of concurrent listening is its seamless extension to the single channel case (discussed above).

This approach requires more sophisticated hardware and software, with the tradeoff of slightly reduced Rx sensitivity.

Concurrent multiprotocol with concurrent listening
  • Ability to support multiple IEEE 802.15.4 protocols such as Zigbee and Thread operating on different channels
  • Rapid switching between two operating channels
  • RX frames differentiated by PAN IDs
  • Channel access managed by normal 802.15.4 CSMA-CA
  • Functional in SoC and RCP modes

 

Example of Concurrent Multiprotocol with Concurrent Listening:

Concurrent multiprotocol an in depth exploration 3
  • Device rapidly switches between the two operating channels every 48 us
  • When a valid 802.15.4 preamble is detected
    • Stays on channel to receive the entire packet
    • Checks to see if it is a valid packet for the network and device
    • Transmits acknowledgement (if required)
  • Switches to the next channel and repeats the process

 

Concurrent Multiprotocol with Bluetooth LE Dynamic Multiprotocol

Concurrent multiprotocol with concurrent listening when combined with Dynamic Multiprotocol (DMP) allows support for three protocols such as Zigbee, OpenThread and Bluetooth LE simultaneously.

It extends the same concept of dynamic multiprotocol support with Bluetooth LE (in a single protocol case such as Zigbee) to a concurrent multiprotocol case (supporting both Zigbee and Thread), where you do not shutdown or de-initialize the entire protocol stack; instead, you keep running a separate (in this case, a third) protocol stack such as Bluetooth LE through time-slicing or time-sharing, where the device would allocate specific time slots for the Bluetooth LE connection.

By periodically swapping the Bluetooth LE PHY with the 802.15.4 PHY, it allows Bluetooth LE connections to remain active, and at the same time stay connected on the Zigbee and Thread networks. This allows the node to respond to either a command via Zigbee, Thread, or Bluetooth.

With a single radio supporting three protocols, careful management of the DMP configuration based on the application requirements becomes critical to ensure optimum performance.

Concurrent multiprotocol an in depth exploration 4
  • Extends Bluetooth LE DMP to concurrent multiprotocol
  • Bluetooth LE continues to operate in time-sliced DMP mode, interrupting CMP (Zigbee + Thread) as needed.
  • With concurrent listening enabled (for Zigbee and Thread to operate on separate channels), the radio rapidly switches between the two 15.4 channels, while switching to Bluetooth LE channel as configured.
  • Does not impact BLE performance (if Bluetooth LE is set as a higher priority)

 

Current Offerings

Concurrent Multiprotocol – Single Channel

Concurrent multiprotocol an in depth exploration 5
  • Enables Zigbee and Thread support on the same 15.4 channel
  • Optionally supports Bluetooth LE in DMP mode
  • Supported in RCP mode (on Series-1) and SoC, NCP, and RCP modes (on Series-2)

 

 

Concurrent Multiprotocol with Concurrent Listening

Concurrent multiprotocol an in depth exploration 6
  • Enables Zigbee and Thread support on separate 15.4 channels
  • Optionally support Bluetooth LE in DMP mode
  • Supported only on Series-2 in RCP (MG21 and MG24) and SoC mode (MG26 – with Matter integrated)

Combining CMP technology with DMP solutions provides versatile options to address the varied demands of modern wireless communication systems. The choice between these approaches depends on the specific needs of your application.

For scenarios where simplicity and strict concurrency without compromising Rx sensitivity are critical, the CMP in a single-channel setup may suffice. In contrast, applications requiring support for separate 15.4 channels in wireless mesh networks may benefit from CMP with concurrent listening. Lastly, for applications demanding maximum flexibility, including support for Bluetooth LE alongside 15.4 mesh networks, CMP with Bluetooth LE DMP is the optimal choice.

By understanding these approaches and their distinctions, you can make an informed decision to select the most suitable technology, ensuring superior performance and reliability for your application.

Works With 2024 has come to an end, but you can catch every minute of this year’s Virtual event on-demand any time here.

It’s hard to believe that this was our fifth Works With event, which we created specifically to provide a platform for IoT developers and manufacturers to learn, network, and exchange ideas. For just a bit of perspective, the first Works With took place at the height of the pandemic, and the world was changing before our eyes. The way our industry – and the world – has adapted and evolved in that time is hard to describe, but the role connectivity has played in that transformation is everywhere you look.

Creating the Works With agenda and content is a long process of assessing customers’ technical market training needs and providing industry-leading content to satisfy this need. We take excruciating care to plan topics, sessions, and speakers that provide practical value for IoT developers, bring together the growing technology ecosystems, and foster collaboration and interoperability. This year’s programming carried that mission forward with technology-specific tracks focusing on Wi-Fi, Bluetooth, LPWAN, Matter, Compute, and IoT Trends. But one of the most significant changes this year was that we hosted four live, in-person events in Austin, San Jose, Hyderabad, and Shanghai. Taking Works With on the road gave us the opportunity to bring these topics to our customers and partners and connect with the global community of innovators who share our passion for connecting devices and improving lives.

We’re extremely proud that today, Works With is considered a can’t-miss industry event and is still the only place wireless developers can access this level of hands-on training from the best and brightest in the industry at no cost and without traveling. We’re also happy to provide every session and keynote from Works With 2024 on-demand. Check out the highlights:

Day 1 Keynote: Connecting the Future: How AI is Accelerating the Next Wave of IoT Evolution

Silicon Labs CEO Matt Johnson and CTO Daniel Cooley, along with David Niewolny, director of business development for healthcare/medical at NVIDIA, discuss the relationship between AI and IoT.

Day 2 Keynote: Works With 2024: IoT Challenges & Solutions Around the World

We announce the Matter Challenge winner, which was a joint program with Arduino and Mouser, followed by Adam Scraba, director of product marketing at NVIDIA, Niranjan Patil from Samsung Research India, and a panel with Jamie Gomez, the CEO of Habitat for Humanity of Metro Denver, about how IoT is delivering on its promise to transform lives by tackling pressing challenges around the world.

Bluetooth Developer Training Sessions

  • BLE201: Silicon Labs: Accelerating End Device Development
  • BLE203: Enable Accurate Distance Estimation Using Channel Sounding
  • BLE204: Harnessing Ambient IoT: A Leap Towards Sustainable Connectivity

LPWAN Developer Training Sessions

  • LPW101: Sub-GHz IoT: An overview of protocols, applications, and key considerations for long-range IoT
  • LPW102: In-Depth Analysis of LPWAN Protocols: Technical Comparison of Wi-SUN, Z-Wave, and Amazon Sidewalk for Smart City and IoT Applications
  • LPW103: Z-Wave Long Range: Bringing Beyond-the-Home Connectivity

Matter Developer Training Sessions

  • MAT101: Introduction to Matter: Why, What, and How
  • MAT102: Matter: Is it the Right Technology for my Products?
  • MAT103: Matter: Technology and Adoption from a User’s and Ecosystem Perspective

IoT Trends Sessions

  • IOT101: Biggest Security Trends and What to Expect
  • IOT102: Revolutionizing large scale IoT deployment with Open CSMP: A Cisco and Silicon Labs Partnership
  • IOT103: Wired to Wireless for the Industrial IoT
  • IOT104: Top Five Medical IoT Trends for Product Designers – Specialist Panel
  • IOT105: Simplifying IoT Development with an RTOS
  • IOT106: Bluetooth Trends of Today and Tomorrow

Wi-Fi Developer Training Sessions

  • WF101: Evolution of Wi-Fi 4 to Wi-Fi 6 and Wi-Fi 7 and How it Affects Your IoT Strategy and Roadmap
  • WF201: The Wi-Fi IoT Developer Journey to Achieve Ultra-Low-Power for your IoT Device
  • WF302: Build a Wi-Fi Tracking Platform with Silicon Labs SiWx917

IoT Partners and Ecosystems Sessions

  • PAR101: Hands-on with Arduino Nano Matter
  • PAR202: Edge Impulse Tutorial for Motion Classification and Anomaly Detection
  • PAR203: Transforming Smart Home Gateways From Wi-Fi to Multiprotocol IoT and Matter

IoT Edge Computing Sessions

  • CMP102: Introduction to Simplicity Studio 6
  • CMP101: Defining the Ideal MCU Platform for IoT Development
  • CMP103: Edge Intelligence: How to leverage Silicon Labs AI/ML to improve efficiency and performance

Now that Works With 2024 is in the books, it’s time to turn our attention to next year. We’ll never have more time to prepare than right now, and with the recent release of Matter 1.4, continued innovation in Bluetooth, Wi-Fi, and other foundational technologies that are driving our industry forward, we better get started.