HSINCHU, Taiwan โ Oct. 9, 2024 โ MediaTek today launched the Dimensity 9400, the companyโs new flagship smartphone chipset optimized for edge-AI applications, immersive gaming, incredible photography, and more. The Dimensity 9400, the fourth and latest in MediaTekโs flagship mobile SoC lineup, offers a massive boost in performance with its second-generation All Big Core design built on Armโs v9.2 CPU architecture, combined with the most advanced GPU and NPU for extreme performance in a super power-efficient design.
The Dimensity 9400 adopts MediaTekโs second-gen All Big Core design, integrating one Arm Cortex-X925 core operating over 3.62GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This design offers 35% faster single-core performance and 28% faster multi-core performance compared to MediaTekโs previous generation flagship chipset, the Dimensity 9300. Built on TSMCโs second-generation 3nm process, the Dimensity 9400 is up to 40% more power-efficient than its predecessor, allowing users to enjoy longer battery life.
โThe MediaTek Dimensity 9400 will continue furthering our mission to be the enablers of AI, supporting powerful applications that anticipate usersโ needs and adapt to their preferences, while also fueling generative AI technology with on-device LoRA training and video generation,โ said Joe Chen, President at MediaTek. โAs the fourth-generation flagship chipset, the Dimensity 9400 continues to build on our momentum of steady growth in market share, and MediaTekโs legacy of delivering flagship performance in the most efficient design for the best user experiences.โ
Packing MediaTekโs 8th Generation NPU, the Dimensity 940feature0 boasts a number of industry firsts for exceptional generative AI performance; it is the first mobile chipset to offer on-device LoRA training, high-quality on-device video generation, and developer support for Agentic AI. To allow users to take advantage of the latest agentic and generative AI applications, the Dimensity 9400 offers up to 80% faster large language model (LLM) prompt performance while also being up to 35% more power efficient than the Dimensity 9300.
The Dimensity 9400 also integrates MediaTekโs new Dimensity Agentic AI Engine (DAE), which is designed to turn traditional AI applications into sophisticated agentic AI applications. MediaTek is working with developers to offer a unified interface between AI agents, third-party APKs, and models that efficiently runs both edge AI and cloud services. This streamlined approach allows models to work with many different third-party APKs, which reduces development time and will help usher in a new ecosystem of agentic AI applications.
The 12-core Arm Immortalis-G925 delivers super immersive gaming experiences with up to 40% faster raytracing performance compared to the previous generation. The Dimensity 9400 also brings PC-level features to smartphones with opacity micromaps (OMM) support for realistic effects. The chipsetโs powerful GPU also offers 41% peak performance boost with up to 44% power savings compared to the Dimensity 9300, allowing users to game for longer. Additionally, the Dimensity 9400 supports HyperEngine technology for super resolution and impressive picture quality, which is co-developed by MediaTek and Arm Accurate Super Resolution (Arm ASR).
With MediaTek Imagiq 1090, the Dimensity 9400 provides HDR video recording throughout the entire zoom range so users can snap the perfect moment from a distance; MediaTekโs Smooth Zoom technology also makes it easy to capture moving subjects. Additionally, it is designed to minimize power consumption while users are taking photos and videos, offering up to 14% lower power consumption in 4K60 video capture compared to the Dimensity 9300.
Additional features of the Dimensity 9400 include:
The first smartphones powered by the MediaTek Dimensity 9400 will be available in the market starting in Q4 of 2024. To learn more about MediaTek’s Dimensity portfolio, please visit: https://www.mediatek.com/products/smartphones-2/mediatek-dimensity-9400.
VIA Technologies has launched its powerful new range of IoT platforms, the SOM-5000, VAB-5000, and ARTiGO A5000, designed for industrial, commercial, and consumer applications that require highly capable edge AI.
Product designers have the option of the VIA SOM-5000, an advanced system-on-module that mounts into a carrier board; the VAB-5000, a pico-ITX form factor with built-in flexible I/O, a 40-pin RPi compatible connector, and direct DC power; and the ARTiGO A5000, an ultra-compact full system. All three are fanless designs, offering exceptional power-efficiency and extensibility.
At their heart, the MediaTek Genio 700 provides a powerful octa-core CPU featuring two Arm Cortex-A78 processors, plus a highly capable Mali-G57 GPU, dual display support, and advanced AV1/H.265/H.264 video decoding. Its multi-core NPU accelerates edge AI applications, enabling immediate responsiveness with on-chip processing. The integrated ISP supports very high-resolution cameras via the dual MIPI CSI interface. Connectivity includes Gigabit Ethernet MAC, plus options for WiFi-6 and 5G wireless connectivity. Applications can be developed using popular Android, Yocto Linux, or Ubuntu OS, and benefit from MediaTekโs NeuroPilot SDK for accelerating AI integration.
Learn more about VIA Technologiesโ new Genio 700 powered platforms >
Among the growing uses ofย AI, one potential application is industrial systems. AI extends the capabilities of machines to sense, learn, reason, and interact with humans in ways that are natural, intuitive, and complementary to the way we work. By pairing AI with IoT to create edge-AI, and connecting insights across production processes, manufacturers can achieve higher quality final products, while also increasing the safety, efficiency, and sustainability of industrial processes. In fact, a recent McKinsey survey found that AI has the potential to unlock approximately $1 trillion in value from the global industrial sector.1
Several use cases have been identified outlining how industrial manufacturers can capture value from AI through technologies such as vision systems, speech-to-text, enhanced connectivity and smart power management:
Read onย to learn howย MediaTek Genioย can bring effective edge-AI technologies into your industrial processes. >
As one of the first adopters of Wi-Fi 7 technology, we wasted no time in establishing an ecosystem of fast, reliable and always-on products that enable MediaTek Filogic Wi-Fi 7 support. Recently, Verizon announced the launch of its networkโs latest Business Internet Gateway, which marks the first product on Verizonโs network to use Wi-Fi 7, and is also one of the first devices in the world to support next-generation Wi-Fi connectivity features such as tri-band and 4×4 antenna capabilities.
The new Verizon Business Internet Gateway features MediaTekโs next-generation modem and router all in one device. In addition to Wi-Fi 7 support provided by the MediaTek Filogic 680, it utilizes theย MediaTek T830 5Gย chipset, which comes with 4CC 300MHz 5G modem capability, 3GPP Release 16 functionality, and is capable of 5G speeds up to 7Gbps. The chip is made using a highly advanced 4nm process for significant power savings, and supports multiple Ethernet options, with speeds up to 10Gbps.
By working closely with Verizon to integrate MediaTekโs Wi-Fi 7 capabilities into the Gateway, users can now enjoy a router that comes with superior performance and design compared to competing FWA devices on the market. After years of development, we are looking forward to seeing the improved experiences that next-generation wireless technology enables for consumers and businesses in the United States.
The Verizon Business Internet Gateway is now available to its Business Internet customers. Learn more about MediaTekโsย 5G Broadbandย andย Wi-Fi 7ย platforms >
